SEMICON China - SESSIONS / EVENTS - History-SEMICON China 2015 - Advanced Packaging

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Date:Tuesday, March 17, 2015
Venue: Pudong Ballroom 2+3 ,Kerry Hotel ,Pudong, Shanghai

It has become the Era of Mobile Internet to the Semiconductor industry since smart phone replaced PC to be the market driving force. Human to human, human to device and device to device computing and communication are everywhere. Handset, the wearable, automobile and IOT, one after another, step into our vision and rebuild our life style. SEMI China will organize the "Advanced Packaging Forum", where industry elites sit together to discuss the technology and solution for the Era of Mobile Internet.

From the market trend to product application, in conjunction with various assembly and test technology, creative equipment and material, together we map a new blueprint of the industry.



Huili Fu, chief IC packaging expert and department director of Packaging Engineering Dept, Huawei (Hisilicon Semiconductor)

13:30~13:55 IoT Related Packaging Solutions - 2.5D / 3DIC enabling New Wave SiPs
Walter Jau, Director,  Corporate R&D, ASE Group
13:55~14:20 JCET Low Cost Packaging Solution

Anderson Bao,
Director of Technology, Engineering and R&D Center, JCET

PPT Download

14:20~14:45 Next generation package solutions for mobile and IoT devices
  Chang-Yi (Albert) Lan
Senior Director, Engineering Center  Siliconware Precision Industries Co., Ltd. (SPIL)
14:45~15:10 A temporary bonding and debonding technology for TSV fabrication

Xiaowei Cheng, Account manager of TEL China

PPT Download

15:10~15:35 磁控溅射物理气相沉积在先进封装中的应用
15:35~16:00 晶圆级封装的优势及劣势


16:00~16:25 Enabling Multi-Die Integration Through Advanced Packaging
Sesh Ramaswami
Managing Director, Packaging Technologies, Silicon Systems Group, Applied Materials
16:25~17:25 Panel Discussion
The Advanced Packaging Technology Demand and Challenge of Mobile Communication and IoT

符会利, Jim Xu, Walter Jau, 包旭升, 藍章益, 丁培军

Jim Xu
Chief Technical Officer, Zeta Instruments

17:25~17:30 Lucky draw for five gifts 


Mr. Jesse Zhang
Tel: +86-21-60278558
[email protected]

Type Early Bird
(Before Mar.2, 2015)
Registration Fee
(After Mar.2, 2015)
RMB 600/位 RMB 800/位
Speaker Free Free