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1. 黄海宾

   ...io 黄海宾 博士/教授 江西汉可泛半导体技术有限公司 董事长 2010博士毕业于南京航空航天大学材料加工工程专业。后到南昌大学从事新能...

   Basic page - 2025-05-14 10:15:12.0

2. SEMI U Tutorial: Advanced Package and 3DIC (Chiplets and HBM) (Workforce Development)

   Date: March 25, 2025 Venue: 5B+5C, Shanghai Inte...

   Basic page - 2025-03-10 18:12:20.0

3. Dr. Qintong Zhang

   ... in condensed matter physics in 2016 from the Institute of Physics, ...

   Basic page - 2024-12-05 00:11:20.0

4. Mr. Xie Zhuo

   ...Ltd. Before found Xinspector in 2022, he worked as senior manager in...

   Basic page - 2024-12-05 00:10:31.0

5. 秦岭

   ...具有丰富的无线电半导体行业经验，两次获得“国家科技进步一等奖”，2001年~2010年期间是展讯通信创业团队核心成员，历任展讯公司执行副...

   Basic page - 2025-09-28 16:13:34.0

6. Mr. Michael Rieger

   .... Mike retired from Synopsys in 2018, where he last served as chief ...

   Basic page - 2024-12-24 13:02:49.0

7. Prof. Yee Sin Ang

   ...and the computational design of 2D semiconductors, interfaces and na...

   Basic page - 2024-12-06 14:22:54.0

8. Prof. Su-Ting Han

   ... of Hong Kong, Hong Kong SAR in 2014. From 2014 to 2016, she was a p...

   Basic page - 2024-12-10 11:56:42.0

9. Prof. Haitao Ye

   ...ions such as EPSRC, EU-FP7, EU-H2020, the Royal Society, the Royal A...

   Basic page - 2024-12-06 14:43:51.0

10. 李太龙

    ...储器封装领域资深专家，凭借在存储器，汽车芯片封装技术及市场领域近20年从业经验，具备了技术研发与商业洞察双重背景，并且始终致力于推动半导...

    Basic page - 2025-09-28 16:09:02.0