Biography:
B.S. in HANYANG University in 2003, majoring in Electronical engineering. M.S. in HANYANG University in 2005, majoring in DEPARTMENT OF ELECTRONICS AND COMPUTER ENGINEERING.
Joined SK hynix from 2005, have worked in Flash memory design team for 10 years,
Now in NAND Product planning Office.
Topic & Abstract:
3D NAND in Mobile： 移动中3D NAND的应用
As the demand for larger capacity at a lower price steadily increases, technology such as feature size scaling down has also been developed. However, scaling down lithography is reaching its limits. As a result, multi-level cell and 3D structures are being presented as alternative solutions for this issue. The 3D structure will give us the chance to expand our technology for several more generation. SK hynix is also paving the way in the development of new technologies. |
