(Conference extended to July 24)
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CSTIC 2020 Plenary Session: Date: Monday, June 29 Time: 8:45-12:00am Venue: Shanghai Ballroom 3, Kerry Hotel Pudong Shanghai No.1388 Hua Mu Road,Pudong, Shanghai, 201204, China Virtual Conference: Opening ceremony, plenary session, 9 symposium presentations, panel discussion, training and posters will be available on-line for live global participation from June 26 to July 17. |
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Dr. Doug Yu Vice President, R&D TSMC |
Dr. Ravi Mahajan Fellow Intel |
Dr. Anthony Yen Vice President ASML |
Dr. Sanjay Natarajan Vice President Applied Materials |
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| Monday, June 29, 2020 | |
| Venue: | Shanghai Pudong Kerry Hotel |
| No.1388 Huamu Road Pudong, Shanghai | |
| Meeting Room: | Shanghai Ballroom 3 |
| 08:45-09:30 | Opening Ceremony |
| 09:30-10:10 | Next Big Frontiers - Chiplet Integration and More |
| Dr. Doug Yu | |
| Vice President, R&D, TSMC | |
| 10:10–10:50 | Opportunities in Advanced Packaging for Heterogeneous Integration |
| Dr. Ravi Mahajan | |
| Fellow, Intel | |
| 10:50–11:25 | EUV Lithography - the Road to High-Volume Manufacturing |
| Dr. Anthony Yen | |
| Vice President, ASML | |
| 11:25–12:00 | Integrated Materials Solutions: A Path Forward For Moore's Law |
| Dr. Sanjay Natarajan | |
| Vice President, Applied Materials | |
Parallel Symposium Sessions
| Online Conference | |
| June 26-July 17, 2020 | Conference Poster Sessions |
| Online Conference | |
| June 29-July 17, 2020 | Parallel Symposium Oral Sessions |
Panel Discussion
| Online Conference | ||
| June 29-July 17, 2020 | ||
| Topic: System Integration through 3D and Advanced Packaging | ||
Training Courses
| Online Conference | ||
| June 28-July 17, 2020 | ||
| Workforce Development | Workforce Development | |
| Advanced Memory Technologies: MRAM | Semiconductor Testing Solutions in the Trend of 5G and AI | |
| Advanced Memory Technologies: ePCM/3D-PCM | Heterogeneous Integration and Advanced Packaging | |
| IC Reliability Tests for 5G Applications | ||
Parallel Symposium Sessions
Symposium I: Device Engineering and Memory Technology
Symposium II: Lithography and Patterning
Symposium III: Dry & Wet Etch and Cleaning
Symposium IV: Thin Film, Plating and Process Integration
Symposium V: CMP and Post-Polish Cleaning
Symposium VI: Metrology, Reliability and Testing
Symposium VII: Packaging and Assembly
Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies