为了您获得更好的浏览体验,请将您的浏览器更新到最新版本!
+86.21.6027.8500
Chinese
2020年6月27-29日
上海新国际博览中心

Panel Discussion

1. We understand that 3D heterogeneous integration will help extend Moore's law from systems’ perspective. Will it be a short-term boost or continuous enhancement node after node?

2. What are the key features for 3D and Advance Packaging Integration, TSV pitch, Chip Layers, etc? How small these critical pitches can go and is there a trend like Moore's law to follow?

3. 3D package vs. 3D sequential integration comparison in terms of thermal budgets, performance, power management, etc.

4. What are the impacts of the 3D and Advance Packaging Integration to the existing OSAT business and supply chains? What are the major opportunities for the existing OSAT business?

 

Meeting Room: 5th Floor Yangtze River Hall

Date: 17:00-18:30, Sunday, March 15, 2020

Topic: System Integration through 3D and Advanced Packaging

Moderator: Dr.Steve X. Liang

 

 

Panelists:

Dr. Doug Yu
Vice President, R&D, TSMC
Dr. Ravi Mahajan
Fellow, Intel
Dr. Bill Bottoms
CEO, 3MTS
     
 
Dr. Yifan Guo
VP, ASE
Dr. Huili Fu