Date: Sunday, June 28, 2020 (Online Conference)
  Language: Chinese


Liang Ge
R&D manager and Test strategy leader
Advantest China
   
  ABSTRACT
  Title: Semiconductor test challenge and solutions for 5G and AI
5G and Artificial Intelligence(AI) is leading the semiconductor market in recent and probably also the coming years. Compare to 4G, 5G brings higher frequency band, wider bandwidth, more complex modulation, massive MIMO and "antenna in package" technology. AI needs very huge computing power, result in high complexity of AI devices which are with latest node of semiconductor process, highest transistor counts and heterogeneous integration in package level. In this lecture, we would like to introduce the latest semiconductor test solution for all above challenges.
• Market trend and key technology of AI device
• Test challenge and solution of AI device
 - 2.5D/3D package
 - DFT & Scan
 - High Power & Thermal control

• Market trend and key technology of 5G
• Test challenge and solution of 5G device
 - 5GNR
 - CA & MIMO
 - mmWave & OTA
   
 

BIOGRAPHY
Liang Ge is the R&D manager and Test strategy leader in Advantest China, in charge of business engagement & development of new test technology for strategic customers. Liang got his master degree in Shanghai Jiaotong university, major in microwave and EM filed technology.