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Session I:
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3D Heterogeneous Advanced Packaging and Manufacturing
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Dein Wang, TSMC
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Challenges and Opportunities in the Heterogeneous Integration
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Fan Chun Ho, Nelson, ASM Pacific Technology Ltd
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DESIGN AND DEVELOPMENT OF 3D WLCSP FOR CMOS IMAGE SENSOR USING VERTICAL VIA TECHNOLOGY
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Tianshen Zhou, HuaTian Technology (Kunshan) Electronics Co., Ltd.
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Soldering Material Evolution for Heterogeneous Integration Assembly
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Lim Sze Pei, Indium Corporation
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Session II:
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Commercialization of through glass via (TGV) technology for 3D packaging
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Daquan Yu, Xiamen University
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Laser Based Full Cut Dicing Evaluation for Thin Si wafers
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Kees-Jan Leliveld, ASM Pacific Technology
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A Single-Layer Solution with Laser Debonding Technology for Temporary Bond/Debonding Applications in Wafer-Level Packaging
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Xiao Liu, Brewer Science
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Etching Type Polymer Technology for Large Number of Small Via
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Ica Han, Simmtech
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Session III:
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Improvement of heat dissipation in IPM packaging structure
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Wenjie Xia, Huangshan University
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Session IV: 3D Heterogeneous Integration Joint session ( VII & VIII)
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Diversity, Interconnect and Phase change: Semiconductor heterogenous integration and supper intelligence in the post Moore's Law era
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Hu Chuan, Guangdong Academy of Sciences
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3D Heterogeneous Integration
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Bill Bottoms, 3MTS
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3D Packaging Development for HPC and 5G Applications
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Chiang Shiuh-Kao, Prismark
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Session V:
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Characteristics of Multi-scale Nano-silver Paste with SiC Particles
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Ziwei Jiang, Shanghai University
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Session VI:
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Investigation of bond pad crystal defect for different cover transmission rate
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Chengyang Sun, HLMC
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Effect of Bonded Ball Shape on Gold Wire Bonding Quality based on ANSYS/LS-DYNA Simulation
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Weidong Huang, Wei Wu, Jacky Wu, Grass Dong, CF Oo, Diodes Shanghai Co., LTD.
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Reliability simulation and life prediction of Sn63Pb37 BGA solder joint under thermal cycling load
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Liu Jiahao, School of Advanced Materials and Nanotechnology, Xidian University
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Yield Improvement and Cost of Test Reduction via Automated Socket Cleaning
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Jerry Broz, International Test Solutions
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