SEMICON China - Symposium VI (2020)

**	to designate keynote talk - 30 min	Sponsored by:
*	to designate invite talk - 25 min
	to designate regular talk - 15 min

Symposium Chair: Peilin Song
Symposium Co-chairs: Baozhen Li

Online Conference
Parallel Symposium Oral Sessions:	June 29-July 17, 2020

Session I: Test I
*	High-Level Approaches to Hardware Security
	Ramesh Karri, New York University, USA
	Multi-granularity Reconfiguration Based Physical Unclonable Function Design
	Jianan Mu, Chinese Academy of Sciences, University of Chinese Academy of Sciences, Beijing, China
	Low-Cost Solution for Ultra-Highspeed SerDes to RF Communication Test via on Board FPGA
	Tang Mingjie, Advantest (China) Co., Ltd.
	A ProgrammingFframework of Concurrent Test on SMT7 for IPs which Share Same Access Port
	Tianyu Zhang, Advantest (China) Co., Ltd.
Session II: Test II
	Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuits
	Shang-Chih Lin, Gallant Precision Machining(GPM), Taiwan, China
	Unifying Yield Enhancement and Manufacturing Intelligence with Smart Sampling
	Zhang Yan Qiu, Fujian Jinhua Integrated Circuit Co., Ltd.
	An Adaptive De-noise System for Sub-nm Scale Failure Analysis Based on TEM Image
	Xu Chang, Fujian Jinhua Integrated Circuit Co., Ltd.
Session III: Metrology I
**	Machine and Deep Learning in optical metrology for Process control
	Dr. Barak Bringoltz, Nova Measuring Instrument, USA
	Wave Front Phase Imaging For Global Silicon Wafer Geometry
	Jan Gaudestad, Wooptix, Spain
	Optical Scatterometry Modeling of 5 nm Logic Metal Gate Structures
	Qi Wang, Shanghai IC R&D Center
Session IV: Metrology II
	Full Metrology Solutions for Advanced RF by Picosecond Ultrasonic Metrology
	Johnny Dai, Onto Innovation, USA
	Monitoring Critical Process Steps in 3D NAND using Picosecond Ultrasonic Metrology with both Thickness and Sound Velocity Capability
	Johnny Dai, Onto Innovation, USA
	Quality Control in Sapphire Production: From Automated Defect Detection to Big Data Approach
	Ivan Orlov, Scientific Visual SA, Switzerland
Session V: Reliability I
*	Towards Understanding Interaction Between Hot Carrier Aging and PBTI
	Prof. Jian Fu Zhang, Liverpool John Moores University, UK
	Comprehensive Comparison of the Wire Bond Reliability Performance of Cu, PdCu and Ag Wires
	Lois Liao Jinzhi, WinTech Nano-Technology Services Pte. Ltd, Singapore
	A Study of Low Temperature Al Sputter Process Electromigration Lifetime
	Jun Liu, Shanghai Huahong Grace Semiconductor Manufacturing Corporation
Session VI: Reliability II
	Non Linear Growth of Variance in the Process Gap
	George W Horn, Middlesex Industries SA, Switzerland
	Research on WBP Product Stress to Improve Product Vr Yield
	Yang Chen, ZTE
	A Novel Vertical Closed-loop Control Method for High-generation TFT Lithography Machine
	Dan Chen, Shanghai Micro Electronics Equipment (Group) CO., LTD.

Conference Poster Session:

June 26-July 17, 2020

	Probe Card Lifetime Control and Abrasion Coefficient Study
	Lei Wang, HHGrace
	Metal Trench Critical Dimension and Overlay Minor Variation Monitoring Method with Voltage Contrast Inspection
	Lijing Huang, HLMC
	The Inspection Solutions and Reduction of Extreme Tiny Poly Residue
	Jianye Song, HLMC
	An Application of Adaptive Genetic Algorithm Combining Monte Carlo Method
	Wei Yu, HLMC
	Investigation and reduction of Systematic defects by wafer backside process in nanometer semiconductor manufacturing
	Jiangang Zhou, HLMC
	Study of high-precision interferometer dynamic switching for TFT long-travel-range moving stage
	Dan Chen, Shanghai Micro Electronics Equipment (Group) CO., LTD.
	Fault Detection of sensor data in semiconductor processing with variational autoencoder neural network
	Wang Yong, Shanghai Huali Microelectronics Corporation
	New Precision Jitter Measurement Solution on TMU
	Kai Zhou, Advantest
	Investigation and discovery of the integration of FEOL process by electron beam inspections
	Fengjia Pan, Shanghai Huali Microelectronics Corporation
	One Comprehensive Method to Analyze Semiconductor Manufacturing Data by "Piecewise" Regression
	Lin Gu, Shanghai Huali Microelectronics Corporation
	The inspection solutions of 3bar structure Cu void in BEOL advanced semiconductor process
	Zhangxingdi, Shanghai Huali Microelectronics Corporation
	The inspection and solution of inline CT defect for 28nm process improvement
	Min Wang, Shanghai Huali Microelectronics Corporation
	The Study and Investigation of Inline E-beam Inspection for 28nm Process Window Monitor
	Yin Long, Shanghai Huali Integrated Circuit Corporation
	A Unified 4H-SiC MOSFETs TDDB Lifetime Model Based on Leakage Current Mechanism
	Hua Chen, Xidian University
	Study on wafer edge test with optimized test solution
	Yuxiang Zhang, Shanghai Huahong Grace Semiconductor Manufacturing Corporation