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1. Symposium VII: Packaging and Assembly(2021)

   ...aging Applying in next AI / HPC Era   Albert Lan, Applied Mater...

   Basic page - 2022-09-29 10:21:04.0

2. Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies(2021)

   ...reak     Session II: MEMS and Biosensors Session Chairs: P...

   Basic page - 2022-09-29 10:22:07.0

3. Symposium IX: Design and Automation of Circuits and Systems(2021)

   ...s Session Chairs: **13:30-14:00 Electronic Design Automation for Eme...

   Basic page - 2022-09-29 10:23:06.0

4. Xiaolin Cai / 蔡晓林

   ...etc. being used for Power, RF, LED, Communications and Sensing marke...

   Basic page - 2022-09-28 15:03:31.0

5. Steve Zhao / 赵洪辰

   ...nstitute of Microelectronics, IMECAS. 摘要 / Abstract Rapid growth in ...

   Basic page - 2022-10-19 15:08:22.0

6. Clare Liu / 刘波

   ...件学院软件工程专业。2003年~2007年就职于应用材料，从事 Etch, CMP, CVD, PVD, RTP, Implant 软件...

   Basic page - 2022-10-26 15:34:50.0

7. Power & Compound Semiconductor Applications in Automotive Summit Forum

   ...rder: 0px solid #cccccc; } .STYLE1 { color: #FF0000; font-weight: bo...

   Basic page - 2023-11-14 15:01:09.0

8. 郭威

   ...facturing Consulting, Schneider Electric(China) Co., Ltd 绿色智能制造咨询总监，...

   Basic page - 2022-10-31 11:58:19.0

9. Elton HE 何国锋

   ...px; border:0px solid #cccccc; } Elton HE 何国锋 VP, Amkor Technolo...

   Basic page - 2024-01-16 14:14:26.0

10. Dr. Byoungho Lee

    ...2021. And he worked for Samsung Electronics, Ultratech, and Nanometr...

    Basic page - 2024-01-17 11:23:58.0