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1. Prof. Woo-Hee Kim

   ... of Science and Technology (POSTECH) in department of materials scie...

   Basic page - 2018-11-19 11:39:47.0

2. Guangyu(Gary) Yang

   ...ociations. Yang has worked in ATE industry for 20 years and gained v...

   Basic page - 2018-12-20 10:47:14.0

3. Hidetami Yaegashi

   ...i Yaegashi Senior Manager Tokyo Electron Limited(TEL), Japan Hidetam...

   Basic page - 2018-11-22 11:16:34.0

4. Dr. Paolo A. Gargini

   Dr. Paolo A. Gargini IEEE Fellow and JSAP Fellow Dr. Gargi...

   Basic page - 2018-12-03 09:10:25.0

5. Dr. Victor Moroz

   ... Moroz is a Synopsys Fellow and Editor of Electron Device Letters, e...

   Basic page - 2018-12-04 13:33:41.0

6. Dr. Xinliang Lu

   ...degree in Materials Science and Engineering from the University of I...

   Basic page - 2018-12-03 09:40:33.0

7. Package: Advanced Wafer Level Package, System in Package (SIP) and Testing

   ...ill be presented and discussed. Emphasis is placed on the latest dev...

   Basic page - 2019-02-28 11:40:15.0

8. Koukou Suu

   ...amp; Technology Strategy, ULVAC Employment: In 1993 and since then h...

   Basic page - 2019-03-05 10:41:13.0

9. Dr. Chengbai Xu

   ...onductor Technologies in DuPont Electronics and Imaging, Marlborough...

   Basic page - 2018-12-05 15:18:31.0

10. Panel Discussion

    ...Fellow, Intel Dr. Bill Bottoms CEO, 3MTS

    Basic page - 2020-06-19 16:30:24.0