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1. Li Yao / 姚力

   ...bsp;姚力 Head of Packaging Design Engineering Department, Unisoc 封装设计工...

   Basic page - 2025-03-20 16:00:06.0

2. Rosemary W.Ho / 何薇玲

   ...sp;何薇玲 Founder, Chairman & CEO, CIP United Co. 何薇玲，上海芯联芯智能科技有限公司...

   Basic page - 2025-03-20 16:13:30.0

3. Dr. Yuan Lu

   Dr. Yuan Lu SMEI and Silex Beijing   YUAN LU,...

   Basic page - 2025-03-21 10:15:22.0

4. Symposium II: Lithography and Patterning

   ...iver Hall Session I: Lithograpy/Etch Joint Session (II & III) Se...

   Basic page - 2025-03-31 15:30:12.0

5. Symposium III: Dry & Wet Etch and Cleaning

   ...tion Considerations for GAA MOSFET Technology   Min Xu, Fudan U...

   Basic page - 2025-03-31 15:32:57.0

6. Symposium IV: Thin Film, Plating and Process Integration

   ... Devices: The Future of Diamond Electronics   Haitao Ye, Univer...

   Basic page - 2025-03-31 15:33:56.0

7. Symposium V: CMP and Cleaning

   ...ention Center Meeting Room: 5D+5E Session I: CMP Session Chairs: Xin...

   Basic page - 2025-03-31 15:35:09.0

8. Symposium VI: Metrology, Reliability and Testing

   ...nd Systems   David Keezer, Eastern Institute of Technology 13:3...

   Basic page - 2025-03-31 15:37:22.0

9. Symposium VII: Packaging and Assembly

   ...ial Considering the Fiber-Weave Effect   Wei Lin, JCET Group *1...

   Basic page - 2025-03-31 15:38:47.0

10. Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies

    ...er Meeting Room: 5A Session I: MEMS Session Chair: Wei Wang **13:00-...

    Basic page - 2025-03-31 15:39:51.0