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1. Heterogeneous Integration (Advanced Packaging) International Conference (HIIC)

   ...el Pudong, Shanghai Chinese and English Simultaneous Interpretation ...

   Basic page - 2026-04-27 10:58:23.0

2. Dr. Felix J. Grawert

   ...elix J. Grawert Chairman of the Executive Board, CEO & President...

   Basic page - 2024-12-30 14:33:14.0

3. Sherry Xu / 徐昀

   ...公司总经理职务，主管公司运营、销售市场和研发业务。秉承着打造国产EDA的历史使命，汇聚战略资源和世界级领军人物和顶级人才，通过自主研发、...

   Basic page - 2025-03-17 13:36:38.0

4. Dr. Bin Liu / 刘斌

   ...大幅提升了半导体企业的生产效率，为行业发展做出了积极贡献。作为IEEE AI-Based Smart Manufacturing Sys...

   Basic page - 2026-02-09 13:40:15.0

5. Dr. Johannes Schoiswohl

   ...oration, San Francisco. Back in Europe he deepened his experience in...

   Basic page - 2026-01-19 16:48:44.0

6. Dr. Russell Low

   ...r. Russell Low President & CEO, Axcelis Technologies 讲师简介 / Spea...

   Basic page - 2026-01-07 13:58:35.0

7. Dr. Yun-Li (Charles) LI / 李允立

   ...) based light-emitting diodes (LEDs) and LED-based applications. In ...

   Basic page - 2024-12-30 14:50:56.0

8. Dr. Rui Zhang

   ...raduated from the Department of Electrical Engineering, The Universi...

   Basic page - 2025-01-03 14:17:45.0

9. Grand Opening Keynote

   ...order:0px solid #cccccc; } .STYLE1 {color: #FF0000} Grand Opening Ke...

   Basic page - 2025-03-26 09:52:58.0

10. Mr. Robert Eklund

    Mr. Robert Eklund Product Manager Mycronic AB &...

    Basic page - 2024-12-05 00:12:34.0