Power & Compound Semiconductor Applications in Automotive Summit Forum
功率及化合物半导体主题活动安排 | |
时间/Time | 活动名称/Event |
6月30日 09:00-17:00 Jun. 30th 09:00-17:00 |
功率及化合物半导体国际产业论坛 Power & Compound Semiconductor International Forum |
7月1日 09:20-17:00 Jul. 1st 09:20-17:00 |
功率及化合物半导体汽车应用发展高峰论坛 Power & Compound Semiconductor Applications in Automotive Summit Forum |
地点:三楼,欢1厅,上海卓美亚喜玛拉雅酒店(上海浦东梅花路1108号) Venue: Grand Ballroom 1, 3F of Jumeirah Himalayas Hotel Shanghai (1108 Mei Hua Road, Pudong, Shanghai) |
![]() |
Chinese and English Simultaneous Interpretation will be provided |
Attendee Registration Previous Review
The "Power & Compound Semiconductor International Forum", which is one of the largest professional events about power and compound semiconductor industry in Asia, will be organized on June 30-July 1, 2023 in Jumeirah Himalayas Hotel Shanghai.The Forum is a two-day program and focuses on topics including: Wide Band Gap Power Electronics, Optoelectronics, Compound Semiconductor in Communications,Emerging Power Device Technology, and Applications in Automotive.
SPONSORS
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
||
Type |
Before Jun.2 with Advanced Payment (Early Bird) |
After Jun.2 and On-site |
Attendees | RMB 1,000 per person | RMB 1,500 per person |
Speakers | Free | Free |
* Agenda is subject to change
联系方式 / Contacts:
吴迪 / Ein Wu | 徐天天 / Robin Xu | 冯莉 / Lily Feng |
Tel: 021.6027.8509 | Tel: 021.6027.8553 | Tel: 021.6027.8546 |
Email: [email protected] | Email: [email protected] | Email: [email protected] |