Power & Compound Semiconductor Applications in Automotive Summit Forum



 功率及化合物半导体主题活动安排
 时间/Time  活动名称/Event
 6月30日 09:00-17:00
 Jun. 30th 09:00-17:00 		 功率及化合物半导体国际产业论坛
 Power & Compound Semiconductor International Forum
 7月1日 09:20-17:00
 Jul. 1st 09:20-17:00 		 功率及化合物半导体汽车应用发展高峰论坛
 Power & Compound Semiconductor Applications in Automotive Summit Forum
 地点：三楼，欢1厅，上海卓美亚喜玛拉雅酒店（上海浦东梅花路1108号）
 Venue: Grand Ballroom 1, 3F of Jumeirah Himalayas Hotel Shanghai (1108 Mei Hua Road, Pudong, Shanghai)
 
Chinese and English Simultaneous Interpretation will be provided

Attendee Registration   Previous Review

The "Power & Compound Semiconductor International Forum", which is one of the largest professional events about power and compound semiconductor industry in Asia, will be organized on June 30-July 1, 2023 in Jumeirah Himalayas Hotel Shanghai.
The Forum is a two-day program and focuses on topics including: Wide Band Gap Power Electronics, Optoelectronics, Compound Semiconductor in Communications,Emerging Power Device Technology, and Applications in Automotive.

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09:00-09:30 Registration / 注册
   
Moderator / 主持人：
David Xiao, Board Chair of AccoPower
肖国伟，广东芯聚能半导体有限公司，董事长
   
09:30-10:00
碳化硅产品在新能源汽车市场前途无量
Gilbert Zhou, President of AccoPower
周晓阳，广东芯聚能半导体有限公司，总裁
   
10:00-10:25
China EV Car Booming – Opportunity for Power Semiconductor
中国电动汽车发展 — 功率半导体的机遇和挑战
Dr. Jeffrey Wang, CEO, Board Director of Shanghai Simgui Technology Co., Ltd.
王庆宇，上海新傲科技股份有限公司，总经理、董事
   
10:25-10:50
应对宽禁带功率材料器件可靠度动态测试挑战的最新技术（Virtual）
Frank Heidemann, CEO of SET GmbH (a Company of NI)
   
10:50-11:15
功率半导体，从硅基到化合物
Guoyou Liu, Vice Chief Engineer of CRRC Zhuzhou Semiconductor
刘国友，株洲中车时代电气股份有限公司，副总工程师
   
11:15-11:40
GaN is Accelerating e-Mobility
氮化镓正加速电动出行的未来
Andy Chuang, VP of Global Business Development of GaN Systems
庄渊棋，GaN Systems，全球业务发展副总裁
   
11:40-13:30 Break / 休息
   
Moderator / 主持人：
Kai Cheng, Board Chair&President of Enkris Semiconductor, Inc.
程凯，苏州晶湛半导体有限公司，董事长、总裁
   
13:30-13:55
高效节能 - 安世半导体赋能汽车行业的可持续发展
Paul Zhang, Sr. VP Global Sales & Marketing, GM China, Nexperia
张鹏岗，安世半导体，全球销售及营销资深副总裁，中国区总经理
   
13:55-14:20
碳化硅功率器件的结构变化和工艺技术挑战
钮应喜，博士、教授级高级工程师，中国科学院半导体研究所
   
14:20-14:45
Challenges and Progress of the Compound Semiconductor Electroplating
第三代半导体电镀挑战和进展
贾照伟，盛美半导体设备（上海）股份有限公司，资深工艺总监
   
14:45-15:10
GaN Progress on Large Size of Substrates
大尺寸GaN材料的新进展
Kai Cheng, Board Chair&President of Enkris Semiconductor, Inc.
程凯，苏州晶湛半导体有限公司，董事长、总裁
   
15:10-15:35
Challenges and Solutions for The Precise Dynamic & Static Characterization and Reliability Test of Automotive Grade Silicon Carbide Power Semiconductor Device
碳化硅功率半导体器件精准动静态特性表征与可靠性测试挑战与解决方案
Saijun MAO, CEO of UniSiC Technology (Shanghai) Co., Ltd.
毛赛君，忱芯科技（上海）有限公司，创始人
   
15:35-16:00
碳化硅功率器件在新能源汽车中的应用与挑战
李冬黎，安徽芯塔电子科技有限公司，应用技术总监
   
16:00-16:25
Key Technologies of Silicon Carbide Power Module and Electro-thermo-mechanical Coupling Design
碳化硅功率模块关键技术与电热力耦合设计
兰欣，元山（济南）电子科技有限公司，CTO
   
16:25-16:45 Lucky Draw 幸运抽奖
   
Two-day registration fee(include 6.30-7.1 Power & Compound Semiconductor event):
Type Before Jun.2 with Advanced Payment
(Early Bird) 		After Jun.2 and On-site
Attendees RMB 1,000 per person RMB 1,500 per person
Speakers Free Free
* Lunch is not included
* Agenda is subject to change

联系方式 / Contacts：
徐天天 / Robin Xu 李晓倩 / Cassie Li 冯莉 / Lily Feng
Tel: 021.6027.8553 Tel: 021.6027.7645 Tel: 021.6027.8546
Email: [email protected] Email: [email protected] Email: [email protected]