Power & Compound Semiconductor International Forum 2022



Date: Tuesday-Wednesday, October 4-5, 2022
Venue: Shanghai Ballroom 3, 3rd Floor, Kerry Hotel Pudong, Shanghai
Location: No.1388 Huamu Road Pudong, Shanghai
Chinese and English Simultaneous Interpretation will be provided

Attendee Registration   Previous Review

The "Power & Compound Semiconductor International Forum 2022", which is one of the largest professional events about power and compound semiconductor industry in Asia, will be organized in conjunction with SEMICON China October 4-5, 2022 in Shanghai Pudong Kerry Hotel.
The Forum is a two-day program and focuses on topics including: Wide Band Gap Power Electronics, Optoelectronics, Compound Semiconductor in Communications, and Emerging Power Device Technology.

SPONSORS

         
         

   
Time：Oct.4th 14:00-17:30，Oct.5th 09:20-16:30
   
Welcome Remark / 欢迎致辞
Lung Chu 居龙
President, SEMI China
SEMI中国，总裁
   
Featured Speakers / 特邀讲师：
   
氮化镓功率半导体在5G基站的应用
Naiqian Zhang 张乃千
President of Dynax Semiconductor, Inc.
总裁，苏州能讯高能半导体有限公司
   
Design Technology Co-Optimization for SiC MOSFET Fabrication in China: Challenges and Opportunities
国产碳化硅MOSFET设计和技术协同合作的机遇和挑战
Shu YUAN 袁述
Professor, Chairman of SiCChip Technologies Inc.
董事长/教授，中科汉韵半导体有限公司
   
碳化硅助力新能源汽车发展
Gilbert Zhou 周晓阳
President of AccoPower
总裁，广东芯聚能半导体有限公司
   
8 Inch GaN-on-Si Power Device Manufacturing: Development and Challenges
八英寸硅基氮化镓功率器件制造: 发展与挑战
HanChin Chiu 邱汉钦
Vice President of Innoscience (Zhuhai) Technology Co., Ltd.
工艺研发副总经理，英诺赛科(珠海)科技有限公司
   
Silicon Carbide Liquid Phase Crystal Growth Technology
液相法碳化硅长晶技术
Min Lu 陆敏
Chairman of Changzhou Perfert Crystal Semiconductor Co., Ltd
董事长，常州臻晶半导体有限公司
   
Development and Applications of GaN RF Power Devices
氮化镓射频功率器件的研究与应用
Jin-Ping Ao 敖金平
Professor of Jiangnan University
教授，江南大学
   
AUT SiC, Way to Boost Green Mobility and Carbon Neutrality
车用碳化硅，通向绿色出行和双碳战略成功的钥匙
Kevin Zhang 张麟
Director of IC R&D Center of Bosch (China) Investment Ltd.
博世中国集成电路研发中心总监，博世（中国）投资有限公司
   
Some Progress of Domestic Optical Inspection Systems for Compound Semiconductors
化合物半导体用国产光学检测设备的一些进展
Aris Ma 马铁中
CEO of AK Optics Technology Co. Ltd
CEO，昂坤视觉（北京）科技有限公司
   
化合物半导体外延量产技术
Ziwen Fang 方子文
Deputy General Manager of AIXTRON SE
副总经理，德国爱思强股份有限公司
   
Atomic Layer Deposition Process and Equipment Set to Transform The More-than Moore Era Up to 300 mm
原子层沉积工艺和设备开创超摩尔时代新维度
Winson Ye 叶惟
Sales Director of Qingdao Sifang SRI Intellectual Technology Co. Ltd
销售总监，青岛四方思锐智能技术有限公司
   
Plasma Etch Processing for Both Power and Wide Bandgap RF End Markets
Michael Yi 易义军
SPTS Technologies
   
Wide Bandgap Industry Status & Future Prospects
宽禁带半导体产业现状与未来展望
Sammy Li 李宛曈
Sales Director of SICC CO., LTD
营销总监，山东天岳先进科技股份有限公司
   
Opportunities for China's Silicon Carbide Power Devices and Industrial Chain in The New Energy Time
国产碳化硅功率器件和产业链在新能源时代下的机遇
Weijiang Ni 倪炜江
GM of Topelectronics.
总经理，安徽芯塔电子科技有限公司
   
   
Two-day registration fee:
Type Before September 16 with Advanced Payment(Early Bird) After September 16 and On-site
Attendees RMB 800 per person RMB 1,000 per person
Speakers Free Free
* Lunch is not included
* Agenda is subject to change

Contacts：
戚发鑫 / Daniel Qi 吴迪 / Ein Wu
Tel: 021.6027.8576 Tel: 021.6027.8509
Email: [email protected] Email: [email protected]