| ** | to designate keynote talk - 30 min | Sponsored by: |
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| * | to designate invite talk - 25 min | |||
| to designate regular talk - 15 min |
Sunday, March 14, 2021 Shanghai International Convention Center
Meeting Room:
Materials and Archictures for Future Computing Platforms
Session Chairs: Dr. Hsiang-Lan Lung/Prof. Fuhua Yang
| 13:30-13:35 | Chairman Remarks |
| *13:35-14:05 | Artificial heterostructures enabled by stacking single-crystalline freestanding membranes |
| Jeehwan Kim, Massachusetts Institute of Technology(MIT) | |
| *13:05-14:35 | Computation-In-Memory with Memristors for Neuromorphic Computing |
| Jianshi Tang, Tsinghua University | |
| *14:35-15:05 | Van der Waals heterostructures for optoelectronic and electronic devicessamples |
| Kaiyou Wang, SKLSM, Institute of Semiconductors, CAS | |
| 15:05-15:35 | Coffee Break |
Session II: MEMS and Biosensors
Session Chairs: Prof. Jingwei Bai/Dr. Chang Chen
| *15:35-16:05 | Surface Redox Buffering Effects on FET Based DNA Sensors with a Gold Sensing Gate |
| Zhen Zhang, Uppsala University | |
| *16:05-16:35 | Far-field optical detection of 10nm Si nanoparticle |
| Stas Polonsky, Samsung, Russia | |
| *16:30-16:55 | Loss Mechanisms of Multi-frequency Whispering Gallery Mode RF-MEMS Resonators |
| Jinling Yang, Institute of Semiconductors, CAS | |
Monday, March 15, 2021 Shanghai International Convention Center
Meeting Room:
Session III: Novel Materials and Processes
Session Chairs: Prof. Zheyao Wang/Dr. Kangguo Cheng
| *8:30-9:00 | Polarization-Sensitive Photodetectors based on 2D Layered Semiconductors |
| Zhongming Wei, Institute of Semiconductors, CAS | |
| 9:00-9:25 | Non-destructive High-resolution Tomographic Cross-sectional Imaging on SuspendedStructures inside a MEMS Package |
| Dai Haiwen, ZEISS Process Control Solutions, Carl Zeiss Pte Ltd | |
| 9:25-9:45 | Wafer Defect Map Similarity Search Using Deep Learning in Semiconductor Manufacturing |
| Sen Wang, Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.(XMC) | |
| 9:45-10:15 | Coffee Break |
| Poster Session: | |
| Design of CMOS Terahertz Detector Array based on Surface Plasmon Resonance Antenna | |
| Haoyu Zhu, Nanjing University | |
| Reduction of random telegraph signal noise by optimizing deep trench isolation process for backside illuminated CMOS image | |
| Chunshan Zhao, Huali Microelectronics Corporation | |
| A MEMS Micro-tweezers for Precision Micro Fabricating and Assembly | |
| Zhang Hao, Dong Chenglong, Li He, Zhang Jie, Wang Xi, Microsystem & Terahertz Research Center, China Academy of Engineering Physics (CAEP), Institute of Electronic Engineering | |
| Design of Millimeter Wave Transceiver Isolation System Based on Polarization Converter and Grating | |
| Jiabing Liu, Nanjing University | |
| A Combination Design of 3D Depth Imaging and 2D Intensity Imaging SPAD Device | |
| KONG XIANGSHUN, Nanjing University | |
| A Study on Pixel Performance of DCG CMOS Image Sensor Through Optimizing Implant Condition | |
| MaoJunxia,Shanghai Huali Microelectronics Corporation | |