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1. Ripley David

   ...HBT Front End modules for 2G/3G/4G cellular handsets. His most recen...

   Basic page - 2016-01-27 14:44:24.0

2. 黄博

   ...dness 2um InGaP HBT3. GaAs pHEMT4. GaN HEMTB. The Reliability in San...

   Basic page - 2016-02-04 17:55:40.0

3. 陈马看 / Makan chen

   ...joined ABB Semiconductors in 2004 with main duty on Design, Manufact...

   Basic page - 2020-01-07 16:20:18.0

4. Gan Feng

   ...裁，从事碳化硅外延生长技术研发及产业化工作。发表SCI收录论文近40篇，申请专利18项。 演讲摘要： Rrogress on Silic...

   Basic page - 2016-01-28 10:17:53.0

5. Min Jeung Cho

   ...ss in Samsung Executive MBA (2014-2016) Samsung Electronics(1996~ No...

   Basic page - 2016-02-03 11:40:47.0

6. 魏少军

   ...niversity, Beijing, China in 1984 and Doctor degree in Applied Scien...

   Basic page - 2016-01-27 18:05:09.0

7. Tom Stokes

   ...has 590 advisory bankers and 1,340 total employees in 28 offices acr...

   Basic page - 2016-01-27 18:07:24.0

8. 朱一明

   ...h.D., EECS, UC BerkeleySept. 1994 – July 1997 M.S., EECS &...

   Basic page - 2016-03-08 16:48:43.0

9. 倪图强

   ...s at Dallas. He holds more than 40 patents in the field of semicondu...

   Basic page - 2016-01-31 00:09:10.0

10. Rich Ray

    ...als Rich joined Honeywell in 2014 as Sr. Marketing Director for the ...

    Basic page - 2016-02-01 11:10:47.0