SearchResult

1. 周健威

   ...工艺和材料有丰富经验。对Memory封装尤其精通，拥有包括DDR4，LPDDR4X，Micro SD, 3D-Nand Flash，eM...

   Basic page - 2021-03-04 16:34:53.0

2. Peter Ventzek

   ... scholarly publications and has 45 granted US patents. His recent re...

   Basic page - 2021-03-10 19:14:09.0

3. Dr. Su Wang 王溯

   ...圆刻蚀后清洗工艺上的研究使我国清洗液及应用技术可以满足12英寸14nm集成电路生产线的应用要求，相应清洗液已大量产业化应用，并成为国内主...

   Basic page - 2021-02-24 13:39:23.0

4. Qi Wu 吴琦

   ...规划及开展业务工作 3. 制定销售计划，组织销售政策、管理制度 4. 督促业务团队进行渠道开发，监督和指导完成各项任务 1999-200...

   Basic page - 2024-12-04 16:23:04.0

5. Dr. Daquan Yu

   ...echnology of TSHT Group from 2014 to 2019. Before that, he was a pro...

   Basic page - 2022-05-22 22:20:49.0

6. Dr. Ara Philipossian

   .... Since its establishment in 2004, he’s been the Co-Founder, Preside...

   Basic page - 2021-11-29 15:52:21.0

7. Dr. KK Kuo 郭桂冠博士

   ... Dr. Kuo developed and produced 4G/5G key RF modules and EMI modules...

   Basic page - 2021-03-04 11:18:22.0

8. Dr. Son Van Nguyen

   ...has been with IBM for more than 40 years and worked on various aspec...

   Basic page - 2022-05-30 15:18:21.0

9. Rosy Wang 王慧卉

   ...物流系统，将产品数字化；3）充分使用生产大数据，构建数字化工厂；4）实现整体工厂的无人化；5）最终实现全面的智能制造。 此次演讲将展现长...

   Basic page - 2021-03-16 14:40:31.0

10. Shi Lei 石磊

    ... Challenge and Package Solution 4.TFME Memory Product and Capability

    Basic page - 2021-03-16 11:50:08.0