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Dr. Huiming Bu
...lliance (JDA) partners through 14nm to 7nm nodes. Currently he is re...
Basic page - 2019-10-09 12:11:04.0
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Jenny Xun / 荀颖
...D合并为Qorvo),现担任IDP应用工程师经理一职,专注领域为4G/5G基站射频芯片的技术应用支持, 产品推广及相关市场的技术演进探究...
Basic page - 2020-06-11 11:47:00.0
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Dr. Zhiwei Liu
.... From July 2003 to December 2004, he joined the Department of High ...
Basic page - 2019-01-28 10:24:20.0
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Dr. li Ma
...eter-wave radar chip packaging, 4G chip fanout packaging, IPD device...
Basic page - 2019-01-28 17:19:07.0
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Jin Pan
...roup of engineers and developed 4 different flavors of final test mo...
Basic page - 2019-02-01 11:22:45.0
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Yun-Li (Charles) Li 李允立
... 李允立博士现为錼创科技的执行长暨创始人。錼创科技创立于 2014年,致力于开发采用 MicroLED 的创新显示技术。 MicroLE...
Basic page - 2021-01-06 10:41:48.0
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Dr. David Wang
...e" 02 project for developing 65-45 nm SFP equipment for Cu interconn...
Basic page - 2021-02-01 15:56:50.0
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Dr. Rich Wise
...TO office of Lam Research in 2014, where he is responsible for strat...
Basic page - 2021-01-14 14:23:38.0
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Dr. Daquan Yu
...ublications. He holds more than 40 patents. He is an IEEE senior mem...
Basic page - 2019-02-01 15:00:45.0
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Dr. Manabu Tsujimura
...d at Ebara Corporation since 1974, CTO of Ebara Corporation since 20...
Basic page - 2019-12-25 14:10:46.0
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