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1. Mark Cao

   ....D., EECS, UC Berkeley Sept. 1994 – July 1997 M.S., EECS & Physi...

   Basic page - 2017-02-21 16:47:39.0

2. Edward Preisler

   ...joined Jazz Semiconductor in 2004 and is now responsible for the dev...

   Basic page - 2017-01-18 16:39:16.0

3. Fan Chun Ho

   ...器件的公司; 于一半导体器件代工厂担任总经理及副总裁。 拥有超过40多项半导体封装技术专利。

   Basic page - 2017-01-19 14:14:44.0

4. Wayne Johnson

   ... not be a simple evolution from 4G. Rather, it is poised to become t...

   Basic page - 2019-01-10 11:06:11.0

5. Kohei Sasaki

   ... has the large bandgap of about 4.5-4.9 eV. Electric field strength ...

   Basic page - 2019-01-02 13:43:27.0

6. Evatec

   ...s tolerating wafer bow of up to 4mm without any contact to the devic...

   Basic page - 2017-01-11 15:39:56.0

7. Symposium IV: Thin Film, Plating and Process Integration

   ...ar talk - 15 min Monday, March 24, 2025 Shanghai International Conve...

   Basic page - 2025-03-23 21:01:03.0

8. Dr. Kiyotaka Imai

   ... from Hokkaido University in 1984 and 1986, respectively. He receive...

   Basic page - 2018-12-27 15:30:51.0

9. John Palmour

   ...he development of high voltage, 4H-SiC power transistors and diodes,...

   Basic page - 2018-12-27 17:02:11.0

10. Christian Urricariet

    ...oles encompassing the company's 400G, 100G, 40G, 10G, 2G and 1G opti...

    Basic page - 2019-01-23 13:05:09.0