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1. Symposium VI: Materials and Process Integration for Device and Interconnection (joint session with Symposium IV)

      Symposium VI: Materials and Process In...

   Basic page - 2016-09-21 13:10:29.0

2. Symposium VII: Advanced Packaging and Heterogeneous Integration

   Symposium Chair: Dr. Steve X. Liang **...

   Basic page - 2026-03-06 16:35:45.0

3. Dr. Changze Liu

   ...irector of Research in Huawei Semiconductor Division Changze Liu (Me...

   Basic page - 2026-01-13 15:56:54.0

4. André Grede

   ...rede Chief Technology Officer Comet Group André Grede is a seasoned ...

   Basic page - 2026-01-14 14:52:07.0

5. The 5th SEMI China Material Committee Meeting (By Invitation)

   ...} The 5th SEMI China Material Committee Meeting (By Invitation) Date...

   Basic page - 2023-05-17 16:35:52.0

6. SEMICON/FPD China 2022 Exhibitor Notice

   ...ina and we look forward to welcoming all to SEMICON/FPD China 2022 s...

   Basic page - 2021-12-21 16:47:42.0

7. Mr. Michael Shifrin

   ... solutions Nova Measuring Instruments Mr. Michael Shifrin is a seaso...

   Basic page - 2021-11-29 16:26:34.0

8. Automotive IC Trend and Test Solution

   ...ernational Convention Center Room: 5H       Title：Aut...

   Basic page - 2021-02-08 11:51:14.0

9. Jun He

   ...cc; } Vice President, Quality & Reliability, TSMC Education: •Ph...

   Basic page - 2020-12-07 17:43:47.0

10. Dr. Tien Wu

    ...order:0px solid #cccccc; } Chairman, SEMI International Board of Dir...

    Basic page - 2025-05-27 14:12:25.0