Vice President, Quality & Reliability, TSMC

•Ph.D. in Materials Science, University of California, Santa Barbara, USA

•Senior Director, Advanced Technology Quality and Reliability, TSMC
•Senior Director, Head of Quality and Reliability for Technology & Manufacturing Group, Intel

•Dr. Jun He is Vice President of Quality and Reliability at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). His responsibility spans across TSMC foundry eco-system, such as incoming materials qualification, reliability and certification of new process technology & design IP, manufacturing quality as well as enabling customers for their product qualification and ramp. Prior to this role, Dr. He was Senior Director of Advanced Technology Quality & Reliability Division at TSMC. Since joining the Company in 2017, he has been leading the development of analytical and test methodology to effectively detect reliability defects and screen problematic products. Such innovations accelerated launch and steep production ramp for 7nm and 5nm technologies. Dr. He also revamped TSMC’s quality management system for incoming materials in 2019 and strengthened collaborative relationship with key suppliers.

•Prior to joining TSMC, Dr. He was a senior director at Intel Corporation, leading overall quality and reliability of process technology development and manufacturing. His scope included research & development of Si, advanced packaging and test along with Intel worldwide manufacturing operations. Dr. He is a three-time winner of Intel Achievement Awards, the highest technical accomplishments at the company, for his technical leadership on low-k dielectric integration, assembly defect detection and development of advanced one-time programmable read-only memory.

•Dr. He holds 36 patents globally, including 28 U.S. patents and published over 50 papers in international conferences and peer-reviewed technical journals. He received his B.S. degree in Physics and Ph.D. in Materials Science from University of California, Santa Barbara.