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1. Symposium III: Dry & Wet Etch and Cleaning(2021)

   ...r: Ying Zhang (Naura) *15:20-15:50 Patterning challenges and perspeti...

   Basic page - 2022-09-29 10:14:36.0

2. Symposium V: CMP and Post-Polish Cleaning(2021)

   ...versity of Technology *15:25-15:50 The Investigation of SiC CMP with ...

   Basic page - 2022-09-29 10:17:54.0

3. Symposium VI: Metrology, Reliability and Testing(2021)

   ... Chen, ZTE Corporation 14:40-15:50 Coffee Break Session VI: Fab Manag...

   Basic page - 2022-09-29 10:19:12.0

4. Symposium VII: Packaging and Assembly(2021)

   ...ps Technology Co.,Ltd. 14:35–14:50 Innovative PVD Technology Solution...

   Basic page - 2022-09-29 10:21:04.0

5. Symposium IX: Design and Automation of Circuits and Systems(2021)

   ...TBD   Frank Feng *14:25-14:50 Multi-GPU Acceleration for Global ...

   Basic page - 2022-09-29 10:23:06.0

6. Gabriela PEREIRA & Taguhi YEGHOYAN

   ...ously and will reach more than ~50% of the market by 2027. The Advanc...

   Basic page - 2022-10-27 14:37:24.0

7. Power & Compound Semiconductor Applications in Automotive Summit Forum

   ...司，总经理、董事     10:25-10:50 应对宽禁带功率材料器件可靠度动态测试挑战的最新技术（Virtual）...

   Basic page - 2023-11-14 15:01:09.0

8. SEMICON China 2022 Forum

   ...ction (event) { let topBuffer = 50; event.preventDefault(); $('html, ...

   Basic page - 2023-02-27 14:13:44.0

9. Advanced Packaging Forum - Heterogeneous Integration

   ...bsp;Previous Review In the past 50 years, Moore's "law" set the stage...

   Basic page - 2023-06-25 12:40:46.0

10. Test54en

    ...ction (event) { let topBuffer = 50; event.preventDefault(); $('html, ...

    Basic page - 2023-05-26 11:06:33.0