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Build China's IC Ecosystem - Advanced Manufacturing, Assembly & Test 2017
...20 Break 15:20-15:50 The Memory Evolution: 2D to 3D and...
Basic page - 2024-04-22 10:39:12.0
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Build China's IC Ecosystem - Equipment and Material
...20 Break 15:20-15:50 The Memory Evolution: 2D to 3D and...
Basic page - 2024-04-22 10:39:49.0
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Dr. Mario Lanza
...al and invited speaker in over 150 conferences, and he and his studen...
Basic page - 2025-12-01 12:31:33.0
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SEMI ECS Student & Engineer Award
...2nd place- 1,800, 3rd place- $1,500) and complimentary meeting regist...
Basic page - 2017-05-04 17:03:52.0
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Symposium II Lithography and Patterning
...; Weimin Gao, Synopsys 16:35-16:50 An off-line roughness evaluation s...
Basic page - 2017-04-07 14:59:45.0
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Symposium IV Thin Film, Plating and Process Integration
...More-than-Moore and a Future of 50 Billion Connected Devices A...
Basic page - 2017-04-07 15:04:24.0
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Symposium V CMP and Post-Polish Cleaning
... Kim, Globalfoundries *14:25-14:50 Nano Scale Interface Control for 2...
Basic page - 2017-04-07 15:06:47.0
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Symposium VI Metrology, Reliability and Testing
... Lattice Semiconductor 14:35–14:50 A statistically robust methodology...
Basic page - 2017-04-07 15:08:52.0
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Symposium VII Packaging and Assembly
... Sun Peng, NCAP *14:30-14:50 In-situ TEM Observations of IMC Ev...
Basic page - 2017-04-07 15:13:15.0
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Symposium VIII MEMS, Sensors and Emerging Semiconductor Technologies
...bsp; Xiuling Li, UIUC *14:25-14:50 Nanoelectronics: Merging Electroni...
Basic page - 2024-12-04 15:05:29.0