Build China's IC Ecosystem
 
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Build China's IC Ecosystem - Advanced Manufacturing，Assembly & Test
| Date: | Wednesday, March 15, 2017 |
| Venue: | Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai |
Catalyzed by the market outlook, policy and the national fund, heat on Semiconductor industry continuously accumulate. There are more than 12inch Fabs planed for the next 5 years, OSAT is expending accordingly. It is easy to build factory but difficult to make it strong and profitable. How the China Semiconductor manufacturing industry is going to enhance the core competency? How to prioritize resource, re-visit the business model, and cooperate together within the ecosystem?
Attendee Registration Previous Review
| Agenda: |
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| Build China's IC Ecosystem - Advanced Manufacturing，Assembly & Test | |
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Moderator: Dr. Yifan Guo Vice President, ASE |
| 9:00-9:05 |
Welcome speech Richard Salsman CFO and Vice President Operations, SEMI |
9:05-9:30
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Innovative 3D-SiP Package Technologies for More than Moore Era. Albert Lan Senior Director, RD & Engineering Center, SPIL PPT Download |
9:30-9:55
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Keynote Speech: 互利共赢 深化中国IC产业布局 Haibo Lei President, HLMC |
9:55-10:20
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Domestic CPU accelerates the internationalization process of China IC industry Frank Fu VP, 兆芯 PPT Download |
10:20-10:45
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Heterogenous Integration and miniaturization for IC package solutions Dr. Jim Li Sr. Director, Central Engineering Integration, ASE |
10:45-11:10
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Assembly Development for Advanced SIP Module Yupeng Xu VP of Engineering, ICPU of JCET |
11:10-11:35
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Strengthening China’s IC Ecosystem with Core Competitiveness Sunny Hui Senior Vice President of Marketing, SMIC |
11:35-12:00
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Advance Package Fan Chun Ho Vice president, ASM PPT Download |
| Build China's IC Ecosystem - Equipment and Material | |
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Moderator: Michael Young GM, APAC Sales, Marketing & Service, AE |
13:00-13:30
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Maximizing fab profitability through lifecycle services Mike McDonald Vice President, Global Service, AE |
13:30-14:00
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Keynote Speech: 高端装备国产化，小集成铸就大时代 Jinrong Zhao President, NAURA |
14:00-14:30
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The back-end market analysis and TEL’s activity Mr. Kawauchi Takuo Region Strategy Division, TEL |
14:30-15:00
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Advanced Packaging Technology & Applications Thomas Bondur Corporate Vice President, Advanced Packaging, MEMS and IoT Business Group, Lam Research |
| 15:00-15:20 | Break |
15:20-15:50
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The Memory Evolution: 2D to 3D and Beyond Er-Xuan Ping Managing Director, Office of the Chief Technology Officer, Applied Materials, Inc. |
15:50-16:20
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Enable IC breakthroughs with MKS Instruments surrounding chambers Wei Shao General Manager, MKS Instruments (Shanghai) Ltd. |
16:20-16:50
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Build cost advantage by right capital equipment purchasing strategy Jonathan Shang General Manager, SurplusGLOBAL China, Inc., SurplusGLOBAL |