SEMICON China - Build China IC Manufacturing Ecosystem

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Date:	Wednesday, March 16, 2016
Venue:	Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai

Moore's law is continuing, memory and foundry are the engine of investment, and IOT cultivates new market demand for chips. The strategic advantage of "close to market" makes it possible for IC design, application and manufacturing companies to work together like virtual IDMs. SEMI will invite experts from the IC design, manufacturing, equipment and material industry, to discuss about how to enhance and integrate the IC ecosystem in China. Four segments of the forum: Advanced manufacturing, Advanced technology, Advanced packaging.

08:30-09:15	Registration
	Moderator： Haijun Zhao COO, SMIC
09:15-09:20	Welcome Remark 叶甜春中国科学院微电子研究所所长
09:20-09:25	Welcome Remark Steve Kelley President & CEO, Amkor Technology
09:25-09:50	把握时代契机，推进国产半导体装备业快速发展赵晋荣北京七星华创总经理 PPT Download
09:50-10:15	The Development Requirements of Semiconductor Equipments for China IC industry Dr. Shawming Ma Deputy General Manager, Plasma Product Group of Mattson Technology PPT Download
Session 1：Advance Manufacturing
10:15-10:40	Collaborate to Win in China Market Sunny Hui SMIC Senior VP, Worldwide Marketing
10:40-11:05	启航十三五, 规划新蓝图 Jack Qi Shu Vice President of Sales & Marketing of HLMC PPT Download
11:05-11:30	Towards 10nm and Beyond Hayakawa Takashi Senior Manager, Technology Marketing Department, Advanced Semiconductor Technology Division, Tokyo Electron Limited
11:30-11:55	Leading the Industry’s development by building a comprehensive financial service platform 杜洋芯鑫融资租赁有限责任公司总裁 PPT Download
11:55-13:00	Lunch Break
Session2: Advance technology
	Moderator： Canyuan Wang Vice president, Tokyo Electron (Shanghai) Limited Chairman
13:00-13:20	Healthy and Strong China IC Ecosystem Needs Critical Materials Shumin Wang 安集微电子CEO
13:20-13:45	Equipment Technology Development in an Era of More-than-Moore (MTM) and The Internet-of-Things (IoT) Dr. ZHENG YUAN Vice president and general manager for 200mm Semi and Subfab Products in the Equipment Product Group (EPG) for Applied Global Services at Applied Materials, Inc. PPT Download
13:45-14:05	THE INTERNET OF THINGS Rich Ray Product Line Director, Honeywell Electronic Materials
14:05-14:30	TEL’s New Approach to Chinese Market Demand Kenny Sunohara VP and FS BU GM, TEL
14:30-14:50	Advanced MEMS Etch Technology and Process Dr. Tom Ni VP & Etch Product Business Group DGM, Advanced Micro-Fabrication Equipment Inc. (AMEC)
14:50-15:15	Enhancing Capital Efficiency and Fab Productivity Throughout the Fab Lifecycle Ms. Michelle Bourke Strategic and Technical Marketing Director Customer Support Business Group LAM
15:15-15:35	Promote the Competition of Local Equipment. Zong Runfu CEO, Kingsemi PPT Download
Session 3：Advance Packaging
	Moderator Dr. Yifan Guo Vice President of Engineering, ASE Shanghai
15:35-16:00	Innovations for a strong OSAT supply chain Dr. Steve Liang CTO and VP of Jiangsu Changjiang Electronics Technology Co., Ltd, China
16:00-16:25	Wafer Level Fan-out and Embedded Technology Albert LAN Senior Director of Engineering Center of SPIL PPT Download
16:25-16:50	New Generation SiP for Miniaturization Dr. KK Kuo Director, R&D, ASE
17:00-17:10	Lucky Draw: SPIL (Apple Watch Sport and iPad mini 4)

*Agenda is subject to change

Type	Before Feb.20 with Advanced Payment(Early Bird)	After Feb.20 and On-site
Attendees	RMB 800 per person	RMB 1,000 per person
Speakers	Free	Free

Contact Us：

Jesse Zhang | 张文达

Tel: 86.21.6027.8558

Email: [email protected]