(** to designate keynote talk, * to designate invite talk)
Sunday, March 12, 2017 Shanghai International Convention Center
Meeting Room: 5D+5E
Session I: Test
Session Chair: Frank Feng
| 13:30–13:35 | Chairman Remarks |
| Peilin Song / Baozhen Li | |
| **13:35–14:05 | Variation and Failure Characterization Through Test Data Analytics |
| Prof. Tim Cheng, Hong Kong University of Science and Technology | |
| 14:05–14:20 | System Qualification Platform for FPGA Board Level Testing And Automated Regression |
| Yibin Sun, Lattice Semiconductor | |
| 14:20–14:35 | Two indirect methodologies for testing FPGA intrinsic programmable logic cell timing performance |
| Hongpeng Han, Lattice Semiconductor | |
| 14:35–14:50 | A statistically robust methodology for optimized sample size determination for FPGA post-silicon validation |
| Weijun Qin, Lattice Semiconductor | |
| 14:50–15:35 | Coffee Break |
|
|
Session II: Test
Session Chair: Kelvin Xia
| *15:35–16:00 | New Approach For Full Chip Electrical Reliability Verification |
| Dr. Frank Feng, Mentor Graphics, USA | |
| 16:00–16:15 | Using VerilogA for Modeling of Single Event Current Pulse: Implementation and Application |
| Jia Liu, Science and Technology on Analog Integrated Circuit Laboratory | |
| 16:15–16:30 |
Finger Print Sensor Molding Thickness None Destructive Measurement with Terahertz |
|
|
Longhai Liu, Advantest Corporation, China |
| 16:30–16:45 | High Efficiency Test System for Envelope Tracking Power Amplifier |
| Feifan Du, National Instruments Corp | |
| Poster Session: | Location: Foyer of Yangtze River Hall |
| Coffee Break | The research of intelligent feedback mechanism between document control and production system |
| Zhou Zhenlin, Semiconductor Manufacturing International (Tianjin) Corp. | |
| Systematic maintenance and application of Failure Modes and Effects Analysis (FMEA) in Semiconductor Manufacturing | |
| LIU ZI QIAN/Hongtao HT Qian, Semiconductor Manufacturing International Corporation | |
| A STUDY ON PROBLEM SOLVING STRATEGY USING EXPERIMENT OF DESIGN | |
| Xinyuan Ji, Semiconductor Manufacturing Inernational Corporation | |
| Improvement on the Stress Migration in Tungsten-Plug Via | |
| Wen Juan, Semiconductor manufacturing International Corporation | |
| High-K Metal Gate Inline Measurement Technique Using XPS | |
| Yang Song, SMIC | |
| A new method for evaluation of SPC chart | |
| Jialei Feng, SMIC | |
| Method Study in Measuring Effective Work Function of HKMG MOSFET | |
| XIAOFENG WANG, Semiconductor Manufacturing International (Shanghai) Corporation | |
| The evolution of mask registration metrology towards most advanced nodes | |
| LIN PEI-YING, Carl Zeiss Co. Ltd | |
| Application Study of Qmerit Function on Overlay Accuracy Verification | |
| HU HUAYONG, SMIC | |
| In-situ Monitoring System Equipped with FT-IR and QMS and Decomposition | |
| Jong-Ki An, bVacuum Center, Korea Research Institute of Standards and Science (KRISS) | |
| Chemical transformations of N,N'-diphenyl-N,N'-bis(1-naphthyl)-1,1'-biphenyl-4,4'-diamine (NPB) under extreme storage conditions | |
| Seob Shim, Korea Research Institute of Standards and Science | |
| Optimization for the measurement parameters of CDSEM for several specific situation | |
| Hanmo Gong, SMIC | |
|
|
|
Monday, March 13, 2017 Shanghai International Convention Center
Meeting Room: 5D+5E
Session III: Metrology
Session Chair: John Li
| *8:30–8:55 | On the use of conductive atomic force microscopy to monitor resistive switching |
| Prof. Mario Lanza, Soochow University | |
| 8:55–9:10 | Effective Method to Automatically Measure the Profile Parameters of Integrated Circuit from SEM/TEM Images |
| Xiaolin ZHANG, Raintree Scientific Instruments (Shanghai) Corporation | |
| 9:10–9:25 | Spectrometric Ellipsometry Application to Optical Metrology Solution of Lithography Process Control |
| Zhenyu Wu, KLA-Tencor China | |
| 9:25–9:40 | Aerial Imaging Metrology (AIMS?) and its applications in mask manufacturing |
| Robert Birkner, Carl Zeiss SMT GmbH | |
| 9:40–9:55 | Measurement of nanoscale grating structure by Mueller matrix ellipsometry |
| Shiqiu Cheng, Raintree Scientific Instruments (Shanghai) Corporation | |
| 9:55–10:10 | Coffee Break |
Session IV: Metrology and Measurement
Session Chair: Ernest Wu
| *10:10–10:35 | Physical Failure Analysis of Semiconductor Devices by Electron Probing and Transmission Electron Microscopy |
| Dr. John Li, Globalfoundries, USA | |
| 10:35–10:50 | The study and investigation of inline e-beam inspection for 28nm process development |
| Yin Long, Shanghai Huali Microelectronics Corporation | |
| 10:50–11:05 | Stress Control Metrology in Epitaxy |
| Yang Song, SMIC | |
| 11:05–11:20 | Low Frequency Noise Characterization of 22 nm PMOS Featuring with Filling W Gate Using Different Precursors |
| He Liang, IMEC | |
| 11:20–11:35 | Exploration of Poly Irms Based on 40nm Technology Node |
| Xiangfu Zhao, Semiconductor Manufacturing International Corporation | |
| 11:35–11:50 | Effect of High Temperature Storage on Fan-out Wafer Level Package Strength |
| Cheng Xu, Nanyang Technological University | |
| 11:50–13:20 | Lunch Break |
Session V: Reliability - I
Session Chair: Jian Fu Zhang
| *13:20–13:45 | System Level Electromigration Reliability |
| Dr. Baozhen Li, IBM Systems Group | |
| 13:45–14:00 | Effects of Copper Line-edge Roughness on TDDB at 28nm and Advanced Technology Node |
| Dongyan Tao, SMIC | |
| 14:00–14:15 | Highly Effective Low-K Dielectric Test Structures and Reliability Assessment for 28nm and Below Technology Node |
| Zhijuan Wang, SMIC | |
| 14:15–14:30 | Study of Safe Operating Area and Improvement for Power Management IC |
|
Sarah Zhou, SMIC |
|
| 14:30–14:45 |
Static Voltage Propagation Approach To Assist Full Chip LUP And TDDB Physical Verification |
|
Yi-Ting Lee, Mentor Graphics |
|
| 14:45–15:00 | Coffee Break |
Session VI: Reliability - II
Session chair: Baozhen Li
| *15:00-15:25 | Time-dependent Clustering Model for Dielectric Breakdown with Variability |
| Dr. Ernest Wu, IBM Research, USA | |
| 15:25-15:40 | Deep Level Investigation of InGaAs on InP Layer |
| Chong Wang, IMEC | |
| 15:40-15:55 | Practical Wafer Level Threshold Voltage Stability Methodology for Fast Evaluation Flash Technology |
| Gang Niu, SMIC | |
| 15:55-16:10 | GDI Failure Mechanism Investigation and Improvement in HK Process |
| Lingxiao Cheng, SMIC | |
| 16:10-16:25 | Fail Mechanism of Program Disturbance for Erase Cell VT Positive Shift in NAND Flash Technology |
| Chunmei Zou, SMIC |