Power & Compound Semiconductor International Forum



 功率及化合物半导体主题活动安排
 时间/Time  活动名称/Event
 6月30日 09:00-17:00
 Jun. 30th 09:00-17:00
 功率及化合物半导体国际产业论坛
 Power & Compound Semiconductor International Forum
 7月1日 09:20-17:00
 Jul. 1st 09:20-17:00
 功率及化合物半导体汽车应用发展高峰论坛
 Power & Compound Semiconductor Applications in Automotive Summit Forum
 地点:三楼,欢1厅,上海卓美亚喜玛拉雅酒店(上海浦东梅花路1108号)
 Venue: Grand Ballroom 1, 3F of Jumeirah Himalayas Hotel Shanghai (1108 Mei Hua Road, Pudong, Shanghai)
 
Chinese and English Simultaneous Interpretation will be provided

Attendee Registration   Previous Review

The "Power & Compound Semiconductor International Forum", which is one of the largest professional events about power and compound semiconductor industry in Asia, will be organized on June 30-July 1, 2023 in Jumeirah Himalayas Hotel Shanghai.
The Forum is a two-day program and focuses on topics including: Wide Band Gap Power Electronics, Optoelectronics, Compound Semiconductor in Communications,Emerging Power Device Technology, and Applications in Automotive.

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08:30-08:55 Registration / 注册
   
08:55-09:00 Speakers' Group Photo / 讲师合影
   
09:00-09:10
Welcome Remark / 欢迎致辞
Lung Chu 居龙
Vice President, SEMI; President, SEMI China
SEMI全球副总裁、中国区总裁
   
Moderator / 主持人:
徐伟,广东芯粤能半导体有限公司,总经理
   
09:10-09:35
GaN Ground
日益渗透的氮化镓功率应用

Gavin Zhu, Founder & CEO of CorEnergy Semiconductor Technology Co. Ltd.
朱廷刚,江苏能华微电子科技发展有限公司,创始人兼总经理
   
09:35-09:55
Enabling Silicon Etch Solutions for Advanced Power Electronics
为先进功率电子提供硅刻蚀解决方案

Dr. David Haynes, Vice President of Specialty Technologies and Strategic Marketing, CSBG, Lam Research Corp.
David Haynes博士,泛林集团客户支持事业部战略营销副总裁
   
09:55-10:15
Technical and Industrial Development of The Silicon Carbide Substrate
碳化硅单晶衬底制备技术和产业相关进展

高超,山东天岳,CTO
   
10:15-10:35
GaN Power Electronics Beyond Adapter Applications
后快充时代的氮化镓功率器件产业化

Wang Ronghua, Vice President of Runxin Microelectronics
王荣华,润新微电子(大连)有限公司,副总经理
   
10:35-10:55
Next Generation Power Electronics - Challenges and Solutions for Scaling in High Volume Manufacturing
下一代电力电子 - 大批量制造中扩展的挑战和解决方案

ZHENG YUAN, Corporate Vice President of Product and Technology, ICAPS, Applied Materials, Inc.
   
10:55-11:15
Domestic Silicon Carbide Equipment Help The Rapid Development of The Third-generation Semiconductor Industry
国产碳化硅装备助力三代半产业腾飞
Boyu Dong, President of Beijing NAURA Microelectronics Equipment Co.,Ltd.
董博宇,北京北方华创微电子装备有限公司,总裁
   
11:15-11:35
High Throughput Epitaxy Solution for Compound Semiconductors
化合物半导体的高产能外延解决方案

Ziwen Fang, Vice General Manager of AIXTRON China
方子文,德国爱思强股份有限公司,中国区副总经理
   
11:35-13:30 Break / 休息
   
Moderator / 主持人:
李顺峰,苏州半导体激光创新研究院,执行院长
   
13:30-13:50
Progress in 6-inch Liquid Phase Silicon Carbide Crystal Growth Technology
6英寸液相法碳化硅长晶技术进展

Min Lu, GM/Board Chair of Changzhou Perfert Crystal Semiconductor Co., Ltd.
陆敏,常州臻晶半导体有限公司,总经理/董事长
   
13:50-14:10
Shaping a Greener Tomorrow: The Impact of Innovative Technologies on Sustainability
塑造一个更绿色的明天: 创新技术对可持续性的影响
Francesco MUGGERI, VP of Power Discrete & Analog Products, APeC/China, STMicroelectronics
Francesco MUGGERI,意法半导体,亚太区功率分立和模拟产品器件部市场和应用副总裁
   
14:10-14:30
Integrated Etch & Deposition Solutions Enabling Compound Semiconductor Power Devices High Volume Manufacturing
刻蚀-沉积一体化赋能化合物半导体功率器件的大规模制造

Dr. XU Kaidong,Jiangsu Leuven Instruments Co., Ltd. Chairman of the Board & CEO
许开东,江苏鲁汶仪器股份有限公司,董事长兼CEO
   
14:30-14:50
Progress in Ion Implantation for The Manufacture of Wide Bandgap Devices
宽禁带半导体制造中离子注入技术进展

Dr. Fulvio Mazzamuto, Staff Applications Scientist of Axcelis
Fulvio Mazzamuto博士,应用科学家- Axcelis
   
14:50-15:10
Microscopy Methods for Failure Analysis in Power Semiconductors
Dr. Thomas Rodgers,蔡司显微镜全球半导体业务负责人
   
15:10-15:30
Advanced Plasma Etch and Deposition Processes for WBG Semiconductors
宽禁带半导体的先进等离子体刻蚀和沉积工艺

Dr Dave Thomas, Vice President Product Management of SPTS Technologies Ltd.
   
15:30-15:55
Applications of Laser Technology in Power and Compound Semiconductor Industries
激光技术在功率及化合物半导体产业的应用

巫礼杰,深圳市大族半导体装备科技有限公司,技术副总经理
   
15:55-16:20
Towards More Powerful and Reliable Devices - Thermo Fisher R&D and FA Solutions
Xiaoxiao Cao, Senior Manager of Market and Business Development , Thermo Fisher
曹潇潇,市场及业务拓展资深经理, PFA,赛默飞世尔
   
16:20-16:45
Green & Safe Exhaust Solutions for the Power & Compound Semiconductor Process
第三代化合物半导体工艺尾气的安全环保解决方案

Dr. Kirel Tang, CTO of Shareway Environment Technology Co., Ltd.
陈佳明,上海协微环境科技有限公司,CTO
   
16:45-17:05
我们需要什么样的SiC MOSFET
高远,泰科天润,应用测试中心总监
   

7月1日 功率及化合物半导体汽车应用发展高峰论坛,精彩继续!
July 1st Power & Compound Semiconductor Applications in Automotive Summit Forum, More exciting content!



Two-day registration fee(include 6.30-7.1 Power & Compound Semiconductor event):
Type Before Jun.2 with Advanced Payment
(Early Bird)
After Jun.2 and On-site
Attendees RMB 1,000 per person RMB 1,500 per person
Speakers Free Free
* Lunch is not included
* Agenda is subject to change


联系方式 / Contacts:
徐天天 / Robin Xu 李晓倩 / Cassie Li 冯莉 / Lily Feng
Tel: 021.6027.8553 Tel: 021.6027.7645 Tel: 021.6027.8546
Email: [email protected] Email: [email protected] Email: [email protected]