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1. Dr. Teng GAO

   ...微电子博士学位，中欧国际工商学院（CEIBS）EMBA学位。 1999年作为Imec亚洲联络部经理，负责市场拓展，项目谈判，及协助项目执...

   Basic page - 2017-03-09 11:46:31.0

2. Behrooz Abdi

   ...osystems Inc. since November 2009 to December 09, 2011. He served as...

   Basic page - 2017-01-22 11:39:46.0

3. Mr. Leopold Beer

   .photo_go{ width:90px; height:90px; overflow: hidden;...

   Basic page - 2018-01-18 16:55:22.0

4. Symposium VI: Materials and Process Integration for Device and Interconnection (joint session with Symposium IV)

   ...Jiang Yan / Beichao Zhang *8:35-9:00 Integration and Devices for 3D-...

   Basic page - 2016-09-21 13:10:29.0

5. Symposium VII: Packaging and Assembly

   ... Session Chair: Steve X. Liang *9:00-09:25 Cu Pad height Measurement...

   Basic page - 2025-03-19 17:35:41.0

6. The 5th SEMI China Material Committee Meeting (By Invitation)

   .photo_go{ width:90px; height:90px; overflow: hidden;...

   Basic page - 2023-05-17 16:35:52.0

7. SEMICON/FPD China 2022 Exhibitor Notice

   ...ing from 21 countries, and over 90,000 attendees from 34 countries/r...

   Basic page - 2021-12-21 16:47:42.0

8. Automotive IC Trend and Test Solution

   ...ined Advantest Europe and In 2019, he returned to China and joined t...

   Basic page - 2021-02-08 11:51:14.0

9. Jun He

   ...em for incoming materials in 2019 and strengthened collaborative rel...

   Basic page - 2020-12-07 17:43:47.0

10. Peter Wennink

    ...1 July 2013. He joined ASML in 1999 as Executive Vice President, Chi...

    Basic page - 2017-12-28 18:07:14.0