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1. Kohei Sasaki

   ..., Japan and by Grant 12025014(F-17-IT-0002).   REFERENCES [1] K....

   Basic page - 2019-01-02 13:43:27.0

2. Symposium IV: Thin Film, Plating and Process Integration

   ...gyang Liu, Lam Research  4-17 Backside Deposition Solution for I...

   Basic page - 2026-03-17 14:30:38.0

3. Dr. Kiyotaka Imai

   ...has been working at TEL since 2017, responsible for advanced device t...

   Basic page - 2018-12-27 15:30:51.0

4. Dr. Ji Chul Yang

   ...a. Since he joined SKhynix in 2017, he is now responsible for innovat...

   Basic page - 2018-09-28 16:00:56.0

5. Dr. Kinam Kim

   ...ifetime Achievement Award" in 2017 and the "Korea Science & Techn...

   Basic page - 2020-06-08 12:15:34.0

6. Dr. Qinghuang Lin

   ... Engineering (SPIE Fellow) in 2017. In 2018, he received the Industri...

   Basic page - 2021-03-05 16:02:41.0

7. Symposium VI: Materials and Process Integration for Device and Interconnection (joint session with Symposium IV)

   ...N Jianhua Xu, SMIC   16:45-17:00 Optimization of Tantalum Nitrid...

   Basic page - 2016-09-21 13:10:29.0

8. Dr. Changze Liu

   ...t of 14/10/7-nm processes. In 2017, he joined Huawei, Shenzhen, China...

   Basic page - 2026-01-13 15:56:54.0

9. The 5th SEMI China Material Committee Meeting (By Invitation)

   ...sday, June 28, 2023 Time: 15:00-17:30 Venue: Hong Room, 2F, Jumeirah ...

   Basic page - 2023-05-17 16:35:52.0

10. SEMICON/FPD China 2022 Exhibitor Notice

    ... canceled on or before November 17, 2021, a cancellation fee of 30% o...

    Basic page - 2021-12-21 16:47:42.0