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1. Martin Anstice

   ...oted to president in December 2010. In January 2012, Mr. Anstice was ...

   Basic page - 2017-12-28 18:01:14.0

2. Dr. Teng GAO

   ...电子专业论坛” 2004年5月为温家宝总理做介绍性的报告。 2010年担任Imec中国总经理； 2012年4月为国务委员刘延东做介绍性的报...

   Basic page - 2017-03-09 11:46:31.0

3. Behrooz Abdi

   ...f Tabula, Inc. since April 6, 2010. Mr. Abdi holds a Bachelor of Scie...

   Basic page - 2017-01-22 11:39:46.0

4. David Allan

   ...lity system that uses more than 100 magnetic, inertial, and optical s...

   Basic page - 2024-12-04 10:55:41.0

5. Tom Thieme

   ...packaging technologies. Since 2010 Tom is with LayTec and contributed...

   Basic page - 2017-01-20 10:20:22.0

6. Symposium VI: Materials and Process Integration for Device and Interconnection (joint session with Symposium IV)

   ...; *14:00-14:25 Flowable oxide: N10 STI Gapfill Challenges Young Lee, ...

   Basic page - 2016-09-21 13:10:29.0

7. Symposium VII: Packaging and Assembly

   ...emiconductor Co., Ltd. 14:55-15:10 Effects of Geometry and Surface Fl...

   Basic page - 2025-03-19 17:35:41.0

8. SEMICON/FPD China 2022 Exhibitor Notice

   ...xhibition space and attracted 1,100 exhibitors coming from 21 countri...

   Basic page - 2021-12-21 16:47:42.0

9. Automotive IC Trend and Test Solution

   ... technical consultant. has fast 10 years of experience in the field o...

   Basic page - 2021-02-08 11:51:14.0

10. Dr. Baozhen Li

    ...y he is working on the 14nm and 10nm technology node development. Bao...

    Basic page - 2017-08-23 14:57:38.0