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1. Symposium I: Device Engineering and Memory Technology

   ...unjin Lee, X-FAB 14:50-15:05 A 110nm BCD-on-SOI Technology offering B...

   Basic page - 2024-03-25 13:29:07.0

2. Symposium II: Lithography and Patterning

   ... FUJIFILM Corporation *15:45-16:10 Acid Generation Efficiency Predict...

   Basic page - 2024-03-25 12:56:33.0

3. Symposium III: Dry & Wet Etch and Cleaning

   ...uven Instruments Co.Ltd. *09:30-10:00 New development of ICP etching ...

   Basic page - 2024-03-25 12:58:27.0

4. Symposium IV: Thin Film, Plating and Process Integration

   ... Wu, HFC Semiconductor 14:50-15:10 Optimization of Deep Trench Isolat...

   Basic page - 2024-03-25 13:00:23.0

5. Symposium V: CMP and Post CMP Cleaning

   ...b, Cordouan Technology 14:50-15:10 Coffee Break     Session...

   Basic page - 2024-03-25 13:03:25.0

6. Symposium VI: Metrology, Reliability and Testing

   ...test (China) Co., Ltd. 14:55-15:10 Highly multi-sites front end test ...

   Basic page - 2025-12-02 14:11:10.0

7. Symposium VII: Packaging and Assembly

   ..., NXP Semiconductors **14:40-15:10 Heterogeneous Integration Ecosyste...

   Basic page - 2024-03-25 13:06:42.0

8. Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies

   ...nese Academy of Sciences *09:35-10:05 NOEMS based on vdW heterostrucu...

   Basic page - 2024-03-25 13:08:52.0

9. Symposium IX: Design and Automation of Circuits and Systems

   ...ashimoto, Kyoto University 9:55-10:10 A Customized Model for Defensin...

   Basic page - 2024-03-25 13:12:15.0

10. Symposium X: AI & IC Manufacturing

    ...di Wang, WITMEM Co., Ltd. 09:45-10:10 The Integration of AI Large Mod...

    Basic page - 2024-03-25 13:14:51.0