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1. Mr. Leopold Beer

   ... and Product Management. From 2013 to 2018 Leopold held the position...

   Basic page - 2024-02-19 11:56:49.0

2. 高超

   ...国务院特殊津贴专家，在集成电路用单晶硅和碳化硅半导体材料领域有近15年的研究及产业化经历。

   Basic page - 2024-03-11 16:01:01.0

3. Dr David Haynes

   ...d Joined Lam Research in June 2016. He is currently Vice President o...

   Basic page - 2024-02-27 10:20:27.0

4. Baoguo Lv / 吕保国

   ...产管理，在该领域取得丰硕成果，做出突出贡献。主持和作为骨干承担了10余项国家科研项目，包括国家02重大专项、863重点项目、发改委高技术...

   Basic page - 2024-01-24 15:54:15.0

5. Prof. Han Wang

   ...titute of Technology (MIT) in 2013. From 2013 to 2014, he worked at ...

   Basic page - 2024-02-18 13:56:09.0

6. Prof. Ming He

   ...IEEE EDL etc. as well as edited 1 book and 2 book chapters. His pape...

   Basic page - 2024-02-01 12:56:39.0

7. 王永成

   ...半导体装备企业，从事半导体行业超精密平面加工设备的设计工作。2011年创立上海致领半导体科技发展有限公司，自主研发并拥有各项发明专利约一...

   Basic page - 2024-03-19 21:11:52.0

8. Jun Zhang / 张骏

   ...l Science and Engineering in 2001 from Shanghai Jiao Tong University...

   Basic page - 2024-12-05 12:09:10.0

9. Francesco MUGGERI

   ...July 2024. Muggeri joined ST in 1995, as a designer for automotive s...

   Basic page - 2025-01-24 14:31:01.0

10. 陈国栋

    ...项目，曾获国家火炬计划项目证书（项目编号：2007GH040481）、深圳市科学技术局科技成果鉴定（登记号：2007087）等奖；主持了...

    Basic page - 2025-01-24 16:06:53.0