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1. Yanhui Zhao / 赵延辉

   ...oving to MEMS product line in 2010 and concentrate on MEMS / Sensors...

   Basic page - 2020-06-16 13:12:11.0

2. Christian Bachmann

   ... in Electrical Engineering in 2011 at Graz University of Technology ...

   Basic page - 2020-06-16 13:14:36.0

3. Dr. Daquan Yu / 于大全

   ...Technology of TSHT Group from 2014 to 2019. Before that, he was a pr...

   Basic page - 2020-06-19 14:52:12.0

4. Dr. Tianniu (Rick) Chen / 陳天牛

   ...former Versum Materials since 2016 and held positions as a global bu...

   Basic page - 2024-12-04 16:17:27.0

5. Shuying.ma / 马书英

   ...公司封装技术研究院院长，拥有多年晶圆级封装技术开发经验，主导完成12寸车载图像传感器晶圆级封装技术，硅基扇出型封装技术，三维系统集成封装...

   Basic page - 2020-06-19 14:58:24.0

6. DeWen Tian / 田德文

   ....5D/3D先进封装制程以及封装仿真、可靠性与失效分析等。 2017年加入歌尔，负责组建青岛市先进封装技术公共服务平台, 该平台投资1....

   Basic page - 2020-06-19 15:01:27.0

7. Terry Chen

   .... Joined Oxford Instrument in 2017, now in charge of the business in...

   Basic page - 2020-06-22 09:57:42.0

8. Xuanwei Dai / 戴玄伟

   ... 华为技术有限公司，技术总监 个人简介 / Biography 15年供电系统设计与产品研发经验，负责超过50个大项工厂供电设计等

   Basic page - 2020-06-23 14:41:13.0

9. Leopold Beer

   ...ctors in Regensburg /Germany in 1994. In 1997 he was assigned as hea...

   Basic page - 2020-06-23 16:47:57.0

10. LeiLei Shinohara / 篠原磊磊

    ...joined RoboSbense in January, 2019. From 2015 to 2018, he was the Te...

    Basic page - 2020-06-23 16:50:33.0