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1. Heterogeneous Integration (Advanced Packaging) International Conference (HIIC)

   ...day, March 24, 2026 Time: 09:30-17:00 Venue: Pudong Ballroom 1, 3F, ...

   Basic page - 2025-12-09 15:05:17.0

2. Prof. Yungang Bao

   ...One Chip (OSOC) Initiative in 2019. His work was published on top co...

   Basic page - 2024-09-29 11:21:53.0

3. Prof. Jianguo Ma

   ...ctoral degree in engineering in 1996 from Duisburg University, Duisb...

   Basic page - 2025-03-06 16:52:23.0

4. Dr. Guanghong Luo

   ...his PhD study, he published >10 peer reviewed papers with >700...

   Basic page - 2024-09-29 11:40:39.0

5. Prof. Zebo Peng

   ...ce from Linköping University in 1987. He has been Professor and Dire...

   Basic page - 2025-09-03 11:33:04.0

6. Dr. Mengwei Si

   ...iversity, Shanghai, China, in 2012. He received his Ph.D. degree in ...

   Basic page - 2024-10-08 12:19:16.0

7. SEMICON/FPD China 2023 Date Change Notice

   ...地点调整如下：  展览日期：2023年6月29日-7月1日  同期会议：2023年6月29日-7月1日  ...

   Basic page - 2022-12-08 17:25:27.0

8. Allen Lee

   ...o joining ATI in 2002, he spent 10 years at S3 Inc., Last position A...

   Basic page - 2020-12-16 13:42:12.0

9. 2022 Exhibition Date Change Notice

   ...or one week, changed from March 16-18, 2022 to March 23-25, 2022. Ve...

   Basic page - 2021-06-16 12:38:09.0

10. Peter Henriksson

    ...r Henriksson joined Mycronic in 1996 and started out working with pa...

    Basic page - 2020-12-16 13:41:59.0