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08:30-09:00
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Registration
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09:00-09:03
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Welcome Speech
Peter Gillespie
SEMI，全球副总裁
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09:03-09:10
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开场介绍 – 储存器最新发展简介
主持人：
彭安
CSO and Vice President of Business Development, Tong Fu Microeletronics Co., Ltd; Deputy to JEDEC Chairman
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09:10-09:40
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主题演讲：美光科技—存储器创新的历史与未来
Dean A. Klein
VP Advanced Memory Solutions, Micron Technology, Inc.
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09:40-10:05
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Nanosecond scale storage: ultrafast SSDs and persistent memory applications of emerging NVMs
Zvonimir Bandic
Sr. Director, Next Generation Platform Technologies, Western Digital Corporation
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10:05-10:30
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Fabless Specialty Memory: A Growing Sector with a Vibrant Eco-System
曹堪宇
Vice President, Strategic Marketing, Gigadevice Semiconductor (Beijing) Inc.
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10:30-10:55
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Advanced Packaging for Flash Memory
梁新夫
CTO, Jiangsu Changjiang Electronics Technology Co., Ltd
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10:55-11:20
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Critical challenges and solutions in 3D NAND volume manufacturing
Rich Wise
Technical Managing Director, Global Product Group, Lam Research Corporation
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11:20-11:45
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Memory Packaging Challenges for the New Era
E. Jan Vardaman
President of TechSearch International, Inc.
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