Dr. Nirmalya Maity
Corporate Vice President, GM, Advanced Packaging Business, Applied Materials

个人简介 / Biography

Dr. Nirmalya Maity is Corporate Vice President at Applied Materials since October 2017 and is the Chief of Staff for the Semiconductor Products Group. He is also responsible for the Packaging Business at Applied.

Before joining Applied Materials, Mr. Maity was at Cabot Corporation since 2004 and held several key leadership positions including Chief Technology Officer and Vice President of Corporate Strategy & Development. Prior to Cabot, he worked for Applied Materials in various technology and product management leadership roles.

Mr. Maity received his PhD in Chemical Engineering from Cornell University and BS in Chemical Engineering from Indian Institute of Technology, Roorkee.

摘要 / Abstract

3D Heterogeneous integration (HI) has been widely used as one of the effective enablers for “More-than-Moore” technology since the advanced wafer node scaling down relying on front-end technology is getting hard to achieve the goal of business return. 3D Heterogenous Integration Packaging allows system designers to integrate a variety of functional dies with different wafer nodes, wafer sizes, and so on – into one packaged unit. That is, it is to enable die partition on a SoC into separate dies and integrate all of them into a assembly unit.

Performance, Power, Area, Cost, Time to market (PPACt) demands of 5G Big Data / High Performance Computing, Artificial Intelligence - IOT (AIOT) require the next level of semiconductor technology solutions. With traditional transistor pitch scaling facing fundamental challenges, 3D Heterogenous Integration Packaging technology is poised to help enabling the future 5G / HPC device applications.