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1. Dr. Paolo A. Gargini

   ...ography, Strained Silicon, High-K/Metal-Gate, FinFET and many new ma...

   Basic page - 2018-12-03 09:10:25.0

2. Package: Advanced Wafer Level Package, System in Package (SIP) and Testing

   ...r, ASM Pacific Technology, Hong Kong ABSTRACT Because of the drive o...

   Basic page - 2019-02-28 11:40:15.0

3. Koukou Suu

   ...ing non-volatile memories, high-K capacitors, LED, power devices, th...

   Basic page - 2019-03-05 10:41:13.0

4. Prof. Horng-Show (Frank) Koo

   Prof. Horng-Show (Frank) Koo Professor of Department of Elect...

   Basic page - 2021-10-18 20:16:49.0

5. 井川 拓人 / Igawa Takuto

   ...ter of Engineering in 2012 from Kyoto University. In 2011, he and so...

   Basic page - 2019-12-27 15:12:12.0

6. Filippo Di Giovanni

   ...tegic Marketing, Innovation and Key Programs Manager within the Powe...

   Basic page - 2020-06-12 11:00:53.0

7. Dr. Klaus Schuegraf

   Dr. Klaus Schuegraf Vice President New P...

   Basic page - 2019-01-11 17:21:13.0

8. Joint Session: Symposium II and Symposium III-Lithography/Etch

   ...ithography/Etch Session Chairs: Kafai Lai & Ying Zhang 13:30-13:...

   Basic page - 2019-02-14 15:10:15.0

9. Advanced Memory Technologies: 3D NAND, DRAM and 3D PCM

   ...nology and Its Scaling Dr. Sean Kang Director, Applied Materials Bio...

   Basic page - 2019-03-01 14:54:29.0

10. Mike Horton

    ...l advanced algorithms such as a Kalman Filter based GPS/INS sensor f...

    Basic page - 2019-01-14 17:33:47.0