SearchResult

1. Symposium I: Device Engineering and Memory Technology(2021)

   ...ing of Ferroelectric FET   Kai Ni, Rochester Institute of Techn...

   Basic page - 2022-09-29 10:07:38.0

2. Symposium II: Lithography and Patterning(2022)

   ...ne 16, Microsoft Teams Meeting) Koichi FUJIWARA, JSR Shanghai Sessio...

   Basic page - 2022-09-27 09:51:34.0

3. Symposium III: Dry &Wet Etch and Cleaning(2022)

   ...rage Controllable ALD Yoshihide Kihara, TEL, Japan *5nm fin SAQP pat...

   Basic page - 2022-09-27 09:52:01.0

4. Symposium IV: Thin Film, Plating and Process Integration(2022)

   ...um Gap Fill Improvement For 28 HKMG Process Shihao Wang, Shanghai Hu...

   Basic page - 2022-09-27 09:52:25.0

5. Symposium V: CMP and Post-Polish Cleaning(2022)

   ...at CMP can do for Waferbonding? Knut Gottfried, Fraunhofer-Institute...

   Basic page - 2022-09-27 09:52:55.0

6. Symposium VI: Metrology, Reliability and Testing(2022)

   ...s in Advanced Nodes Efi Megged, KLA Study on Weighted Binary Classif...

   Basic page - 2022-09-27 09:53:11.0

7. Symposium VII: Packaging and Assembly(2022)

   ...nges for Off-the-shelf Chiplets Kaisheng Ma, Tsinghua University Int...

   Basic page - 2022-09-27 09:53:24.0

8. Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies(2022)

   ...ms Meeting) Yang Chai, The Hong Kong Polytechnic University *Resonan...

   Basic page - 2022-09-27 09:53:52.0

9. Symposium IX: Design and Automation of Circuits and Systems(2022)

   ...zation for Latch-based Circuits Kaixiang Zhu, Fudan University A Tra...

   Basic page - 2022-09-27 09:54:14.0

10. Shu YUAN / 袁述

    ...博士后 （电子材料系） • 奥地利开普勒大学(Johannes Kepler Univ.) 博士 （半导体物理研究所） • 复旦大学 硕...

    Basic page - 2022-09-28 14:43:22.0