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1. Dr. Xinliang Lu

   ...niversity of Illinois at Urbana-Champaign. He has more than 19 years...

   Basic page - 2018-12-03 09:40:33.0

2. Package: Advanced Wafer Level Package, System in Package (SIP) and Testing

   ...9 Venue: Shanghai International Convention Center Room: 5H   &n...

   Basic page - 2019-02-28 11:40:15.0

3. Koukou Suu

   ... & Technology Strategy, ULVAC Employment: In 1993 and since then...

   Basic page - 2019-03-05 10:41:13.0

4. Dr. Chengbai Xu

   Dr. Chengbai Xu Global R&D Director,...

   Basic page - 2018-12-05 15:18:31.0

5. Dr. Yukiteru Matsui

   Dr. Yukiteru Matsui Chief Specialist Toshiba Memory Corp...

   Basic page - 2019-02-22 14:35:25.0

6. Panel Discussion

   ...ckaging Integration, TSV pitch, Chip Layers, etc? How small these cr...

   Basic page - 2020-06-19 16:30:24.0

7. Prof. Horng-Show (Frank) Koo

   ...ently the Director of the Smart City Academic-Industry Research Coll...

   Basic page - 2021-10-18 20:16:49.0

8. Dr. J. Joshua Yang

   ...he Department of Electrical and Computer Engineering at the Universi...

   Basic page - 2019-01-07 09:06:53.0

9. Song Bai / 柏松

   ...rofessor, Zhongdian Guoji South Co. , Ltd. 教授级高工，中电国基南方有限公司 个人简介 / B...

   Basic page - 2020-06-23 10:59:28.0

10. 井川 拓人 / Igawa Takuto

    ...ounded FLOSFIA Inc. (known as ROCA K.K at that time) as a engineer a...

    Basic page - 2019-12-27 15:12:12.0