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1. Symposium II: Lithography and Patterning(2022)

   ...II & Symposium III) Session Chairs: Leo Pang (D2S) / Ying Zhang ...

   Basic page - 2022-09-27 09:51:34.0

2. Symposium III: Dry &Wet Etch and Cleaning(2022)

   ...David Xiao, Shanghai Integrated Circuit Research and Develop (ICRD) ...

   Basic page - 2022-09-27 09:52:01.0

3. Symposium IV: Thin Film, Plating and Process Integration(2022)

   ...Opening Remarks Beichao Zhang **Cutting-edge epitaxial processes of ...

   Basic page - 2022-09-27 09:52:25.0

4. Symposium V: CMP and Post-Polish Cleaning(2022)

   ...signate regular talk Session I: CMP Session Chair: Xinping Qu Openin...

   Basic page - 2022-09-27 09:52:55.0

5. Symposium VI: Metrology, Reliability and Testing(2022)

   ...d, KLA Study on Weighted Binary Classifier with Imbalanced SEM defec...

   Basic page - 2022-09-27 09:53:11.0

6. Symposium VII: Packaging and Assembly(2022)

   ...Opening Remarks Steve X. Liang *Chiplet Cost Model Analysis, Opportu...

   Basic page - 2022-09-27 09:53:24.0

7. Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies(2022)

   ..., Microsoft Teams Meeting) Yang Chai, The Hong Kong Polytechnic Univ...

   Basic page - 2022-09-27 09:53:52.0

8. Symposium IX: Design and Automation of Circuits and Systems(2022)

   ...Topology Optimization of Analog Circuits via Graph Embedding Fan Yan...

   Basic page - 2022-09-27 09:54:14.0

9. Xiaoxiao Cao / 曹潇潇

   ...r:0px solid #cccccc; } Xiaoxiao Cao 曹潇潇 Senior Manager of Marke...

   Basic page - 2023-05-22 12:35:33.0

10. Jin-Ping Ao / 敖金平

    ... from Jilin University in 2000, Changchun, China. He joined HSRI in ...

    Basic page - 2022-09-28 14:42:25.0