Design Innovation Forum - Automotive IC
Date: | Friday, June 30, 2023 |
Time: | 15:30-17:00 |
Venue: | Grand Ballroom 2, 3F, Jumeirah Himalayas Hotel Shanghai |
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Simultaneous Interpretation will be provided. |
Attendee Registration Previous Review
The increase of automotive electronics implantation, the development of self-driving, intelligent cockpit, IoT applications and Al in automotive industry will be the strongest driving force for semiconductor and chips in the coming 10 years.In 2022, China’s new energy vehicle (NEV) sales reached 6.88 million units, account for over 60% global market share, which attract more international chipmakers as well as encourage local supplier chain to engage in.
In this year’s Design Innovation Forum - Automotive IC, heavyweights from automotive IC industry will share insights in emerging technology, auto revolution trends, and how to collaborate to capture the opportunities evolving with it.
Organizers
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Agenda / 议程 | |
15:30-15:40
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Welcome Remarks/欢迎致辞 Lung Chu, President, SEMI China; Vice President, SEMI 居龙,SEMI全球副总裁、中国区总裁 |
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Moderator /主持人 Dr. Xiaoning Qi, Vice President, Alibaba Group 戚肖宁,阿里巴巴集团副总裁 |
15:40-16:00
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Transforming China Semiconductor Industry with accelerated innovation 加速创新,同塑中国半导体产业未来 Danny Perng, Senior Vice President PacRim, Siemens EDA 彭启煌,西门子EDA全球资深副总裁、亚太区总裁 |
16:00-16:20
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Building Chinese EDA Solutions for Automotive Electronics 打造汽车电子国产EDA解决方案 Liu Weiping, Chairman of the Board, Empyrean Technology Co., Ltd. 刘伟平,华大九天董事长 |
16:20-16:40
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The Core Breakthrough of Artificial Intelligence 人工智能的芯突破 Rosemary W.Ho, Founder, Chairman & CEO, CIP United Co. 何薇玲,上海芯联芯智能科技有限公司创始人、董事长兼首席执行官 |
16:40-17:00
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The automotive-grade SoC IP technology drives automotive intelligence 核心车规级SoC IP技术推动汽车智能化发展 Zack Zheng 郑魁,Imagination中国汽车产品市场副总裁 |
CONTACT US:
Hannah zhao 021-60278571 [email protected]