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1. Symposium IV: Thin Film, Plating and Process Integration

   ... Trench Isolation on 0.18μm SOI BCD Technology for Automotive Applic...

   Basic page - 2024-03-25 13:00:23.0

2. Symposium V: CMP and Post CMP Cleaning

   ...n Technology 14:50-15:10 Coffee Break     Session II: ILD ...

   Basic page - 2024-03-25 13:03:25.0

3. Symposium VI: Metrology, Reliability and Testing

   ...onvention Center Meeting Room: 3B Session I: Test I Session Chair: X...

   Basic page - 2025-12-02 14:11:10.0

4. Symposium VII: Packaging and Assembly

   ...onvention Center Meeting Room: 5B+5C Session I: 3D and Advanced Pack...

   Basic page - 2024-03-25 13:06:42.0

5. Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies

   ... Systems through Innovations in BEOL-Compatible Oxide Semiconductor ...

   Basic page - 2024-03-25 13:08:52.0

6. Symposium IX: Design and Automation of Circuits and Systems

   ...d Technology 14:35-14:50 Coffee Break     Session II: Desi...

   Basic page - 2024-03-25 13:12:15.0

7. Symposium X: AI & IC Manufacturing

   Symposium Chair: Prof. Bin Yu, Zhejiang University, China *...

   Basic page - 2024-03-25 13:14:51.0

8. CSTIC Agenda 2024

   ...;       Dr. Peng Bai CEO, Rong Semiconductor, China P...

   Basic page - 2024-03-25 13:23:11.0

9. CSTIC 2024

   ...;       Dr. Peng Bai CEO, Rong Semiconductor, China P...

   Basic page - 2024-04-15 15:38:21.0

10. 叶继春

    ...宁波材料技术与工程研究所，研究员 讲师简介 / Speaker Bio 叶继春，中科院宁波材料所研究员，新能源技术所副所长，国家科技创新...

    Basic page - 2024-04-19 15:36:51.0