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1. Symposium III Dry &Wet Etch and Cleaning

   ...ning Remarks   Kafai Lai, IBM **13:35-14:05 The Path Forward: T...

   Basic page - 2024-12-04 15:02:36.0

2. Symposium IV Thin Film, Plating and Process Integration

   ...e-than-Moore and a Future of 50 Billion Connected Devices   Aar...

   Basic page - 2017-04-07 15:04:24.0

3. Symposium V CMP and Post-Polish Cleaning

   ...trol for 28nm Cu CMP through Cu/Barrier Slurries   Zhijie Zhang...

   Basic page - 2017-04-07 15:06:47.0

4. Symposium VI Metrology, Reliability and Testing

   ...an Remarks   Peilin Song / Baozhen Li **13:35–14:05 Variation a...

   Basic page - 2017-04-07 15:08:52.0

5. Symposium VII Packaging and Assembly

   ...onvention Center Meeting Room: 5B+5C Session I: Session Chair: Dr. H...

   Basic page - 2017-04-07 15:13:15.0

6. Symposium VIII MEMS, Sensors and Emerging Semiconductor Technologies

   ...50-15:15 NOVEL ELECTRON DEVICES BASED ON LASER SCRIBED GRAPHENE &nbs...

   Basic page - 2024-12-04 15:05:29.0

7. Symposium IX Circuit Design, Systems and Applications

   ...on-Volatile Logic-In-Memory and Beyond   Sharon Hu, University ...

   Basic page - 2017-04-07 15:18:58.0

8. Prof. Kuan-Neng Chen

   ...a Research Staff Member at the IBM Thomas J. Watson Research Center....

   Basic page - 2017-07-12 09:27:41.0

9. Dr. Shin-Puu Jeng

   ...-Puu Jeng was a Director of the Backend Technology Service Division ...

   Basic page - 2025-03-31 14:02:09.0

10. Symposium I: Device Engineering and Memory Technology

    ...provement of Monolithic CFET by Backside Enhanced Contact with C-typ...

    Basic page - 2025-03-31 15:29:17.0