Compound Semiconductor Asia Conference (CS Asia) 2025

Date: | Tuesday-Thursday, March 25-27, 2025 |
Venue: | 3F, Kerry Hotel Pudong, Shanghai |
Location: | No.1388 Huamu Road Pudong, Shanghai |
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Chinese and English Simultaneous Interpretation will be provided |
Attendee Registration Online Agenda
The "CS Asia Conference 2025", which is one of the largest professional events about power and compound semiconductor industry in Asia, will be organized in conjunction with SEMICON China 2025 on Mar 25-27, 2025 in Kerry Hotel at Shanghai.
Diamond Sponsors: |
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Gold Sponsors: |
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SPONSORS
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Featured Speakers / 特邀讲师:
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Dr. Felix J. Grawert | SCHOISWOHL Johannes | Dr. Yun-Li (Charles) Li |
Mar.25th 13:45-14:15 | Mar.25th 14:45-15:15 | Mar.25th 15:45-16:15 |
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Jianjun (Joe) Cao | Dr. BARRY JIA-FU LIN | Dr. Atsushi Nishikawa |
Mar.25th 16:15-16:45 | Mar.27th 09:15-09:45 | Mar.26th 15:30-16:00 |
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Daniel Twitchen | Tim Bettles | Dr. LIANG WU |
Mar.26th 9:45-10:15 | Mar.27th 10:40-11:05 | Mar.26th 9:15-9:45 |
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GAO Chao | LI, Shunfeng | ZHANG Xing |
Mar.25th 16:30-17:00 | Mar.27th 9:45-10:15 | Mar.26th 10:40-11:05 |
Day 1- Mar.25th, 2025 Shanghai Ballroom 3 / 上海厅 3 | |
13:00-16:30 | CS Asia Conference - Opening Keynote / 亚洲化合物半导体大会 - 开幕主题演讲 |
13:15-13:30
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Welcome Remark / 欢迎致辞 Lung Chu 居龙 Vice President, SEMI; President, SEMI China SEMI全球副总裁、中国区总裁 |
13:30-14:00
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Compound Semiconductor - Age of Maturity Dr. Felix J. Grawert Chairman of the Executive Board, CEO & President AIXTRON SE |
14:00-14:30 |
Reserved IQE |
14:30-15:00
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Next Generation Power Semiconductors (SiC and GaN) Enabling A World of Decarbonization and Digitalization SCHOISWOHL Johannes Senior Vice President and General Manager Infineon Technologies Austria AG |
15:00-15:30 |
Reserved Axcelis Technologies |
15:30-16:00
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MicroLED Display Technology Mass Production Strategy MicroLED 前瞻顯示技術量產策略 Dr. Yun-Li (Charles) LI 李允立 Chairman 董事长 PlayNitride Inc. 錼創科技 |
16:00-16:30
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Next Generation GaN Platform for High-Density DC-DC Converters Jianjun (Joe) CAO 曹建军 Co-founder Efficient Power Conversion (EPC) Corporation |
16:30-17:00
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Progress on 300mm SiC Substratess and Opportunities and Challenges to Industry (Pending) Chao GAO 高超 CTO SICC |
Day 2- Mar.26th, 2025 Shanghai Ballroom 3 / 上海厅 3 | |
09:00-12:00 | Session 1: Ultra-wide Bandgap Semiconductors Materials / 分会1:超宽禁带半导体材料 |
09:15-09:45
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Recent Progress and Device Prospects on Bulk AlN Crystals Grown by PVT Method Liang WU 吴亮 CEO Ultratrend Technologies |
09:45-10:15
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Key Developments and Challenges in CVD Diamond Substrates for Electronic Device Applications (Pending) Daniel Twitchen Executive Director, Business Development & Technologies Sales Element Six |
10:15-10:40 |
The Current Industrial Situation and Prospects of The Development of The 4th Generation Semiconductor Ga2O3 第四代半导体氧化镓的产业发展现状与前景 Zhengwei CHEN 陈政委 CEO Beijing MIG Semiconductor Co., Ltd. |
10:40-11:05
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Progress of Ultra-Wideband Diamond Semiconductor Material and Devices Research 超宽禁带金刚石半导体材料和器件研究进展 Xing ZHANG 张星 CEO Compound Semiconductor (Xiamen) Technology Co., Ltd. |
11:05-11:30 |
Reserved |
Day 2- Mar.26th, 2025 Shanghai Ballroom 3 / 上海厅 3 | |
13:00-16:30 | Session 2: Innovative Technologies for Compound Semiconductors / 分会2:化合物半导体的革新技术料 |
13:30-14:00 |
Reserved |
14:00-14:30 |
Reserved |
14:30-15:00 |
Reserved |
15:00-15:30 |
Novel Techniques for Production Molecular Beam Epitaxy Matthew Marek Sr. Director of Product Line Management Veeco Instruments Inc. |
15:30-16:00
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TBD Nishikawa Atsushi CTO ALLOS SEMICONDUCTOR |
16:00-16:30 |
Reserved |
Day 3- Mar.27th, 2025 Pudong Ballroom 1 / 浦东厅 1 | |
09:00-12:00 | Session 3: III-V Compound Semiconductors / 分会3:III-V 化合物半导体 |
09:15-09:45
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Journey through The Frequency Domain-Compound Semiconductor Dr. BARRY JIA-FU LIN CTO Wavetek Microelectronics |
09:45-10:15
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Research and Development on High Power Semiconductor Edge and Surface Emitting Lasers Shunfeng LI 李顺峰 Executive Director Suzhou Everbright Institute of Semiconductor Lasers |
10:15-10:40 |
Reserved |
10:40-11:05
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Scaling Compound Semiconductor Materials for Future Markets Tim Bettles VP of Business Development AXT |
11:05-11:30 |
锑化物红外激光器技术创新与应用发展 Yu ZHANG 张宇 IOS, CAS 中科院半导体所 |
Day 3- Mar.27th, 2025 Pudong Ballroom 1 / 浦东厅 1 | |
13:00-16:30 | Session 4: GaN, SiC Materials, Equipment and Power Device / 分会4:氮化镓,碳化硅材料、设备及功率器件应用 |
13:30-14:00 |
TBD Adam Barkley VP of Power Device R&D Wolfspeed |
14:00-14:25 |
Reserved |
14:25-14:50 |
(拟)1700V:新的氮化镓耐压基准 Doug Bailey VP of Marketing Power Integrations |
14:50-15:15 |
TBD Elpin Goh Senior Director, Specialty Technologies 客户支持事业部特色工艺资深总监 Lam Research Corporation 泛林集团 |
15:15-15:40 |
Reserved |
15:40-16:05 |
TBD Kenji Kambayashi SICOXS GM of Marketing & Sales Department |
16:05-16:30 |
Reserved |
CS Asia Conference Schedule / 亚洲化合物半导体大会日程 | Venue / 场地 | ||
2025.3.25 Tue. 2025年3月25日 周二 |
13:00-16:30 |
CS Asia Conference - Opening Keynote 亚洲化合物半导体大会 - 开幕主题演讲 |
Shanghai Ballroom 3 上海厅 3 |
2025.3.26 Wed. 2025年3月26日 周三 |
09:00-12:00 |
Session 1: Ultra-wide Bandgap Semiconductors Materials 分会1:超宽禁带半导体材料 |
Pudong Ballroom 5 浦东厅 5 |
13:00-16:30 |
Session 2: Innovative Technologies for Compound Semiconductors 分会2:化合物半导体的革新技术 |
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2025.3.27 Thu. 2025年3月27日 周四 |
09:00-12:00 |
Session 3: III-V Compound Semiconductors 分会3:III-V 化合物半导体 |
Pudong Ballroom 1 浦东厅 1 |
13:00-16:30 |
Session 4: GaN, SiC Materials, Equipment and Power Device 分会4:氮化镓,碳化硅材料、设备及功率器件应用 |
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Event location 活动地点 |
3F of Pudong Kerry Hotel (No.1388 Huamu Road Pudong, Shanghai) 浦东嘉里酒店3楼(上海市浦东新区花木路1388号) |
Three-day registration fee:
Type |
Before Mar.7 with Advanced Payment (Early Bird) |
After Mar.7 and On-site |
Attendees | RMB 1,500 per person | RMB 2,000 per person |
Speakers | Free | Free |
* Agenda is subject to change
联系方式 / Contacts:
戚发鑫 / Daniel Qi | 吴迪 / Ein Wu |
Tel: 021.6027.8516 | Tel: 021.6027.8509 |
Email: [email protected] | Email: [email protected] |