Power & Compound Semiconductor International Forum 2024
Date:
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Thursday-Friday, March 21-22, 2024
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Venue:
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Pudong Ballroom 1, Kerry Hotel Pudong, Shanghai
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Location:
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No.1388 Huamu Road Pudong, Shanghai
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Chinese and English Simultaneous Interpretation will be provided
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Attendee
Registration Previous
Review
The
"Power & Compound Semiconductor International Forum 2024", which is one of the largest professional events about power and compound semiconductor industry in Asia, will be organized in conjunction with
SEMICON China 2024 on Mar 21-22, 2024 in Kerry Hotel at Shanghai.
The Forum is a two-day program and focuses on topics including: Wide Band Gap Power Electronics, Optoelectronics,
Compound Semiconductor in Communications, and Emerging Power Device Technology.
Gold Diamond Sponsor:
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SPONSORS
Day 1- Mar.21st, 2024
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08:30-09:20
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Registration / 注册
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09:20-09:25
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Welcome Remark / 欢迎致辞
Lung Chu 居龙
Vice President, SEMI; President, SEMI China
SEMI全球副总裁、中国区总裁
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Moderator / 主持人:
David Xiao, Board Chair of AccoPower
肖国伟,广东芯聚能半导体有限公司,董事长
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09:30-09:55
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MicroLED Technology Entering Mass Production: Opportunities and Challenges in The New Era
MicroLED技術的量產:機會與挑戰的新時代
李允立,錼創科技,董事长
Dr. Yun-Li (Charles) Li, Chairman of PlayNitride Inc.
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09:55-10:20
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大尺寸SiC单晶衬底制备
杨昆,河北同光半导体股份有限公司,总工程师
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10:20-10:45
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How Power and Compound Semiconductor Drive Sustainable Innovation
功率和化合物半导体如何推动可持续创新
Francesco MUGGERI, VP of Power Discrete & Analog Products, APeC&China, STMicroelectronics
Francesco MUGGERI,意法半导体,亚太区功率分立和模拟产品器件部市场和应用副总裁
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10:45-11:10
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Compound Semiconductor Infrared Measurement Technology and Equipment
化合物半导体红外量测技术与设备
任杰,盖泽华矽半导体科技(上海)有限公司,总经理&首席执行官
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11:10-11:35
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Ion Implantation and Applications for Power Device
Causon Ko-Chuan JEN, Ph.D. SVP, Technical Marketing, Axcelis Technologies,Inc.
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11:35-12:00
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Enabling Solutions for the High-Volume Manufacturing of GaN Devices
氮化镓器件批量生产的解决方案
Elpin Goh, Senior Director, Specialty Technologies, Lam Research Corporation
Elpin Goh,泛林集团,客户支持事业部特色工艺资深总监
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12:00-13:30
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Break / 休息
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Moderator / 主持人:
Rong Xuan, CEO of Best Compound Semiconductor Co., Ltd.
宣融,南京百识电子科技有限公司,总经理
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13:30-13:55
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Development of Silicon Carbide Epitaxy and Wafer Manufacturing Technology
碳化硅外延与晶圆技术发展
Rong Xuan, CEO of Best Compound Semiconductor Co., Ltd.
宣融,南京百识电子科技有限公司,总经理
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13:55-14:20
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Ahead of What’s Next with ASM’s Silicon Carbide Epitaxy
ASM 碳化硅外延技术赋能未来
Krishna Sreerambhatla, Vice President, Head of SiC Epitaxy business, ASM
Krishna Sreerambhatla, ASM副总裁,SiC外延业务负责人
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14:20-14:45
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Accelerating Si, SiC & GaN Power Devices’ PPACt (Power, Performance, Area, Cost, Time to Market) Scaling
加速 Si, SiC 以及 GaN 功率器件的PPACt (功率,性能,面积,成本,产品上市时间) 技术迭代
Dr. Yi Zheng, Senior Director, ICAPS, Applied Materials
郑毅,应用材料公司ICAPS事业部高级总监
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14:45-15:10
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SiC Wafer Polishing Process and Prediction of Its Developing
碳化硅晶片抛光工艺及其发展预测
王永成,上海致领半导体科技发展有限公司,总经理
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15:10-15:35
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Advanced Sinter Solutions from Heraeus Electronics
先进烧结解决方案
Dr.Jing Zhang, Heraeus Materials Technology Shanghai Ltd, Head of Shanghai Innovation Center, Heraeus Electronics China
张靖,上海贺利氏工业技术材料有限公司,贺利氏电子中国研发总监
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15:35-16:00
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Towards More Powerful and Reliable Future—Thermo Fisher Solutions for SiC Devices R&D and Yield Enhanced
迈向更强更可靠的未来—赛默飞半导体功率器件研发及良率提升解决方案
Xiaoxiao Cao, Senior Business Development Manager, PFA, Thermo Fisher Scientific
曹潇潇,赛默飞世尔科技,高级业务拓展经理
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16:00-16:25
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Ultra Fast Laser Technology Combined with AI Empowers Extreme Manufacturing of Compound Semiconductors
超快激光技术叠加AI赋能化合物半导体极端制造
Haoquan Fang, MegaRobo Technologies, Vice General Manager of Semiconductor Business Unit
方浩全,镁伽科技,半导体事业部副总经理
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Day 2 - Mar.22nd, 2024
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Moderator / 主持人:
徐伟,广东芯粤能半导体有限公司,总经理
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09:30-09:55
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碳化硅主驱将成为中高档电动汽车的主流
Gilbert Zhou, President of AccoPower
周晓阳,广东芯聚能半导体有限公司,总裁
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09:55-10:20
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大尺寸碳化硅单晶衬底制备技术挑战及进展
高超,山东天岳先进科技股份有限公司,CTO
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10:20-10:45
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GaN Power Device: Development and Challenges
氮化镓功率器件:发展和挑战
邱绍谚,京东方华灿光电股份有限公司,氮化镓电力电子研发总监
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10:45-11:10
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Demand Leadership, Technological Innovation, Building a New Ecosystem for China's Silicon Carbide Industry
需求引领,技术创新,构建中国碳化硅产业新生态
李仕群,北京北方华创微电子装备有限公司,行业总经理
北京北方华创微电子装备有限公司
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11:10-11:35
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High Throughput Epitaxy Solution for Compound Semiconductors
化合物半导体的高产能外延解决方案
Vincent Meric, Vice President, Product & Marketing, AIXTRON SE
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11:35-12:00
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EPI Application in Compound Semiconductor by Nicolet FT-IR iG50.
Nicolet iG50傅里叶变换红外在化合物半导体外延中的应用
Michael Lee, Semiconductor Measurement Manager of Thermo Fisher Scientific
李云鹏,赛默飞世尔科技,半导体晶圆材料量测负责人
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12:00-13:30
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Break / 休息
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Moderator / 主持人:
Kai Cheng, Board Chair&President of Enkris Semiconductor, Inc.
程凯,苏州晶湛半导体有限公司,董事长、总裁
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13:30-13:55
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GaN Progress on Large Size of Substrates
大尺寸GaN材料的新进展
Kai Cheng, Board Chair&President of Enkris Semiconductor, Inc.
程凯,苏州晶湛半导体有限公司,董事长、总裁
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13:55-14:20
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CoreGaN:助力双碳 降本增效
章涛,江苏能华微电子科技发展有限公司,产品应用副总裁
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14:20-14:45
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Integrated Etch & Deposition Solutions Enabling Compound Semiconductor Power Devices High Volume Manufacturing
刻蚀-沉积一体化赋能化合物半导体功率器件的大规模制造
Dr. Wuping Liu, VP of Customer Applications & Technology of Jiangsu Leuven Instruments Co., Ltd.
刘武平,江苏鲁汶仪器股份有限公司,产品研发中心副总经理
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14:45-15:10
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Key Manufacturing Challenges in HVM of SiC and GaN Power Devices
Aditya Vyas, Vice President of Business Development, Onto Innovation,Inc.
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15:10-15:20
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Lucky Draw 幸运抽奖
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Two-day registration fee:
Type
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Before Mar.1 with Advanced Payment
(Early Bird)
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After Mar.1 and On-site
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Attendees
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RMB 1,000 per person
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RMB 1,500 per person
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Speakers
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Free
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Free
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* Lunch is not included
* Agenda is subject to change
联系方式 / Contacts: