Plenary Session
| Date: | Monday-Tuesday, March 18-19, 2019 |
| Venue: | Shanghai International Convention Center 上海国际会议中心 |
| No.2727 Riverside Avenue Pudong, Shanghai 200120, China 中国上海浦东滨江大道2727号 |
Distinguished Conference Keynote Speakers
| Monday, March 18, 2019 | |
| Meeting Room: | 3rd Floor Auditorium |
| 08:45-09:30 | Opening Ceremony |
| Opening Remarks by Conference Chair | |
| Opening Remarks by SEMI | |
| Opening Remarks by IMEC | |
| Opening Remarks by STCSM | |
| Opening Remarks by Sponsors | |
| Presentation of IMEC Best Student Paper Awards and SEMI Best Young Engineer Paper Awards | |
| 09:30-10:15 | The Floating-Gate Memory from Concept to Flash Memory to the Fourth Industrial Revolution |
| Dr. Simon M. Sze | |
| Honorary Chair Professor, NCTU | |
| 10:15–10:50 | Moore's Law and Evolving Challenges in Technology Scaling |
| Dr. Yaoguo (Gary) Ding | |
| Vice President, Intel | |
| 10:50–11:25 | Semiconductor Innovation and Scaling: A Foundry Perspective |
| Dr. Min Cao | |
| Vice President, Path-finding, TSMC | |
| 11:25–12:00 | "In-memory Computing": Accelerating AI Applications |
| Dr. Evangelos Eleftheriou | |
| Fellow, Neuromorphic Computing, IBM | |
Parallel Symposium Oral Sessions
| Monday, March 18, 2019 | |
| 13:30-17:00 | Parallel Symposium Oral Sessions |
| Coffee Break | Conference Poster Session |
| Tuesday, March 19, 2019 | |
| 8:30-18:00 | Parallel Symposium Oral Sessions |
Panel Discussion
| 17:00-18:30, Monday, March 18, 2019 | |
| Technologies for AI Chips: Challenges and Opportunities |
Training Courses
| 14:00-17:00, Tuesday, March 19, 2019 | |
| Workforce Development | Advanced Memory Technologies: 3D NAND, DRAM and 3D PCM |
| Workforce Development | Package: Advanced Wafer Level Package, System in Package (SIP) and Testing |
Joint Sessions
| 13:30-15:20, Monday, March 18, 2019 | |
| Symposium II and III-Lithography/Etch joint session | |
| 10:30-12:00, Tuesday, March 19, 2019 | |
| Symposium II, VIII and IX-AI joint session |
Parallel Symposium Oral Sessions
Symposium I: Device Engineering and Memory Technology
Symposium II: Lithography and Patterning
Symposium III: Dry & Wet Etch and Cleaning
Symposium IV: Thin Film, Plating and Process Integration
Symposium V: CMP and Post-Polish Cleaning
Symposium VI: Metrology, Reliability and Testing
Symposium VII: Packaging and Assembly
Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
Symposium IX: Design and Automation of Circuits and Systems
Conference Banquet
| Monday, March 18, 2019 | |
| Banquet fee |
800RMB/Person |
| 18:30-20:30 |
Conference Banquet, 上海小南国国会店(http://www.xnggroup.com) 上海市浦东新区滨江大道2727号7楼 |
Hotel Floor Layout
