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(** to designate keynote talk, * to designate invite talk) |
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Meeting Room：5th Floor Yangtze River Hall
Joint Session: Symposium II and Symposium III-Lithography/Etch
Session Chairs: Kafai Lai & Ying Zhang
| 13:30-13:35 | Opening Remarks |
| Kafai Lai / Ying Zhang | |
| **13:35-14:05 | Advanced Etch Challenges and Perspective Solutions |
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Rich Wise, Lam Research, US |
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| **14:05-14:35 | Precise Etching Profile Control by Atomic-Scale Process |
| Yoshihide Kihara, TEL, Japan | |
| **14:35-15:05 | Boosting Computational Lithography Performance with High Speed Metrology and Machine Learning Technology |
| Gary Zhang, ASML-Brion | |
| 15:05-15:20 | Coffee Break |
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Session II: Computational Lithography
Session Chairs: Yayi Wei & David Wei
| *15:20-15:45 | Reduction and control of edge placement error at the 5nm node through a holistic approach |
| Robert Socha, ASML | |
| 15:45-16:00 | Semi-implicit Mask Synthesis With Additive Operator Splitting |
| Yijiang Shen, Fei Peng, Guangdong University of Technology | |
| *16:00-16:15 | EUV Mask near Field Synthesis |
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Taian Fan, IMECAS |
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| 16:15-16:30 | Tomographic Mueller-matrix scatterometry and its application in nanostructure metrology |
| Xiuguo Chen, Shiyuan Liu, HUST | |
| *16:30-16:55 |
Quantifying Improvements in Field to Field and Wafer to Wafer CD Variation |
| Will conley, Cymer | |
| 16:55-17:10 | Design Driven test patterns for SMO OPC and SPA |
| Le Ma, Lisong Dong, Libin Zhang, IMECAS | |
| Yingli Duan, Gangzheng Intellectual Property Center Co., Ltd | |
| Yayi Wei, IMECAS, University of Chinese Academy of Sciences | |
Tuesday, March 19, 2019 Shanghai International Convention Center
Meeting Room: 5th Floor Yangtze River Hall
Session III: Mask
Session Chairs: Leo Pang & Chris Progler
| 8:30-8:35 | Opening Remarks |
| Leo Pang / Chris Progler | |
| **8:35-9:05 | Multi-Beam Mask Writer for Advanced Patterning |
| Naoya Hayashi, DNP | |
| *9:05-9:30 | How Curvilinear Mask Patterning will Enhance the Wafer Process Window: A Study Using Rigorous Wafer+Mask Dual Simulation |
| Ryan pearman, D2S | |
| *9:30-9:55 | Multi-beam mask writer MBM-1000 |
| Hiroshi Matsumoto, NuFlare | |
| 9:55-10:10 | Effective mask patterning strategy as design complexity and CD stability |
| Young Ham, Yohan Choi, Michael Green, Mohamed Ramadan, Chris Progler, Photronics | |
| 10:10-10:30 | Coffee Break |
Joint Session: Symposium II, Symposium VIII and Symposium IX-AI
Session Chairs: Qinghuang Lin & Wenjian Yu
| **10:30-11:00 | How to Successfully Overcome Inflection Points by Using the Technology Roadmap methodology |
| Dr. Paolo Gargini, Chair, IRSD Roadmap, USA | |
| **11:00-11:30 | Edge Computing for Intelligent Healthcare |
| Prof. Sharon Hu, University of Notre Dame, USA | |
| **11:30-12:00 | Advances in IC Mask Synthesis and Tape Out Operations in the era of Machine Learning |
| Steffen Schulz, Mentor | |
| 12:00-13:25 | Lunch Break |
Session V: Novel Technology / Metrology
Session Chairs: Motokatsu Imai & Qiang Wu
| **13:25-13:55 | High Power LPP-EUV Source with Long Collector Mirror Lifetime for Semiconductor High Volume Manufacturing |
| Hakaru Mizoguchi, Gigaphoton | |
| *13:55-14:20 | EUV Lithography optics - current status and outlook |
| Dr. Dirk Jürgens, Zeiss | |
| *14:20-14:45 | Pattern fidelity control on EUV via hole towards 5-nm node |
| Hidetami Yaegashi, TEL | |
| *14:45-15:10 | Study of CD-SEM based and other reference metrologies for line width roughness (LWR) control on EUV photoresist and less than 20nm width materials |
| Takeshi Kato, Hitachi High Technologies | |
| 15:10-15:25 | Self-Aligned Assembly of Block Copolymer Pattern on Graphene Nanoribbon Arrays |
| Shisheng Xiong, Fudan university, University of Chicago | |
| Robert M. Jacobberger, Tzu-Hsuan Chang, Zhenqiang Ma, Michael S. Arnold, University of Wisconsin-Madison | |
| Guangpeng Wu, Paul F. Nealey, University of Chicago | |
| 15:25-15:40 | Coffee Break |
Session VI: Material / Toolings
Session Chairs: Wanh Yueh & Zhimin Zhu, Gyomei Shiba & Hai Deng
| *15:40-16:05 | Evolution of Lithographic Materials Enabling the Semiconductor Industry | ||
| Cheng-Bai Xu, DowDupont | |||
| *16:05-16:30 | Tailoring Material and Process Variables to Control Planarization Properties at ≤ 7-nm nodes | ||
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Daniel M. Sullivan, Brewer Science |
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| *16:30-16:55 | Defectivity Reduction in EUV Lithography Materials using Advanced Filtration Technologies | ||
| Rao Varanasi, Pall Semiconductor | |||
| *16:55-17:10 | Advanced Lithography Material Status toward 5nm Node and beyond | ||
| Koichi FUJIWARA, JSR Shanghai Co., Ltd. | |||
| *17:10-17:25 | Novel gap filling BARC with high chemical resistance | ||
| Yuto Hashimoto, Nissan Chemical Corporation | |||
| *17:25-17:50 | High Volume Semiconductor Manufacturing using Nanoimprint Lithography | ||
| Keita Sakai, Canon | |||
| *17:50-18:05 | Thin Film Characterization for advanced patterning | ||
| Zhimin Zhu, Brewer Science | |||
| Poster Session: | Location: 5th Floor | ||
| Coffee Break | The comparison between VT5 and CM1 in 28nm WELL resist modeling | ||
| Mudan Wang, Yiqun Tan, Juan Wei, Haibin Yu, Shirui Yu, Shanghai Huali Microelectronics Corporation | |||
| 0.75NA ArF Tool can be capable for over 90nm technology in 200nm FAB | |||
| Weifeng Li, Huiping Shen, Yili Gu, Lei Wang, Shanghai Huahong Grace Semiconductor Manufacturing Corporation | |||
| Machine Learning SRAF improves OPC Performance at 1X node and below | |||
| Hu Hongmei, Wei Yuan, Yifei Lu, ICRD | |||
| Xi-Chen Sheng, Yue-liang Yao, Yan-Jun Xiao, Wen-hao Zhao, Yifei Lu, ASML Brion Technologies | |||
| Study of Pattern Projection on OPC Accuracy and Efficiency | |||
| Zhang Shasha, Shanghai Huali Microelectronics Corporation | |||
| The Monitor Strategies of Lens Flare for Nikon ARF and KRF Scanner Machines: Simulated Results and Discussion | |||
| Zhe Zheng, Zhenyu Yang, Chun Shao, Nikon Precision SHanghai Co., LTD. | |||
| Junji Ikeda, Nikon Corporation | |||
| Mechanism Study of Wafer Surface Charge during Dual Damascene Process and an Effective Removal Method Using Functional Rinse | |||
| Heguang Shi, Weihua Sang, Jingan Hao, Semiconductor Manufacturing International Corp. | |||
| Critical Dimension Uniformity Improvement of Negative Toned Developing Process for Hole Type Pattern | |||
| Rui-Lin Zhang, Hai-Hua Chen, Jing-An Hao, Zhi-Feng Gan, He-Guang Shi, Qing-Qiu Tang, Yan-Li Li, Semiconductor Manufacturing International Corp. | |||
| Challenge and Solution for A Typical Array Structure in Metal Layout | |||
| Zhifeng Gan, Peipei Liang, Xiaochi Xu, Xiaolin Hu, Jingan Hao, Semiconductor Manufacturing International Corp. | |||
| Spin-on-carbon material buried voids defect analysis and improvement in Via patterning process with double exposure lithography | |||
| Haihua Chen, Jingan Hao, SMIC Technology Research & Development (Shanghai) Corporation | |||
| Resist model tuning for short bar type pattern in Negative Tone Development Process | |||
| Xiaolin Hu, Zhifeng Gan, Jingan Hao, Technology R&D, Semiconductor Manufacturing International Corp. | |||
| The impact of segment length on the Process window in SMO | |||
| Yonghua Zhang, Haoru Hu, Institute of Microelectronics of Chinese Academy of Science, Guizhou University | |||
| Lisong Dong, Yayi Wei, Institute of Microelectronics of Chinese Academy of Science | |||
| Prediction model of etching bias based on artificial neural network | |||
| Haoru Hu, Yonghua Zhang, Institute of Microelectronics of Chinese Academy of Science, Guizhou University | |||
| Lisong Dong, Yayi Wei, Institute of Microelectronics of Chinese Academy of Science | |||
| Mask and Template Assignment on DSA-MP with Triple BCP Materials Lithography | |||
| Cong Cao, Jianli Chen, Wenxing Zhu, Fuzhou University | |||
| Xingquan Li, Minnan Normal University | |||
| The Study of Mask Crosstalk Defects from Developer and Etching | |||
| Heng-Jen Lee, Yuan Hsu, Jackie Cheng, Mei-Yu Liu, Colbert Lu, Tomas Chin, Photronics DNP Mask Corp. | |||
| Advanced ceramic protective lifetime prolong for particle control | |||
| Yuan Hsu, Yutaka Satou, Heng-Jen Lee, Photronics DNP Mask Corp. | |||
| Methodology for Building MPC Model for Advanced Lithography Nodes | |||
| Mohamed Ramadan, Yohan Choi, Michael Green, Young Ham, Chris Progler, Photronics | |||
| Brian Dillon, Nippon Control System Corporation | |||
| Experimental and Simulative investigation of the impact of LWR | |||
| Zhou Fang, Wang Zhanyu, Chang Liu, SMIC | |||
| Exposure system improvement for greater productivity | |||
| Takahiro Takiguchi, Kenta Kita, Yosuke Takarada, Ryo Kasai, Satoru Sugiyama, Tsuneari Fukada, Canon Inc. | |||
| The Principle of Source Mask Optimization (SMO) Pattern Selection in Complex Two-dimensional Situation Based on the Diffraction Spectrum | |||
| Miao Xia, Song Bai, Tao Song, SMIC Advanced Technology R&D Co. Ltd. |