China Memory Strategic Forum
Tuesday, March 14, 2017
Venue: Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai

Global market of Memory product is about 80 Billion$, nearly half of it in China. Driven by mobile communication, cloud computing and IOT, Flash Memory market will keep upside in predictable future. How shall the multi-national enterprises get more benefit from China market, leveraging on the technical advantage? How shall the Chinese companies learn from the industry leaders and gain respectful position in the global market, leveraging on the market advantage? Industry leaders will join the forum to break the ice.

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08:30-09:00 Registration
09:00-09:03 Welcome Speech
Peter Gillespie
SEMI, Global VP
Opening Introduction—The Latest Development of Memory Industry
Andrew Peng
CSO and Vice President of Business Development, Tong Fu Microeletronics Co., Ltd; Deputy to JEDEC Chairman

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Keynote speaking- A History and Future of Memory Innovation
Dean A. Klein
VP Advanced Memory Solutions, Micron Technology, Inc.

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Nanosecond scale storage: ultrafast SSDs and persistent memory applications of emerging NVMs
Zvonimir Bandic
Sr. Director, Next Generation Platform Technologies, Western Digital Corporation

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Fabless Specialty Memory: A Growing Sector with a Vibrant Eco-System
Mark Cao
Vice President, Strategic Marketing, Gigadevice Semiconductor (Beijing) Inc.

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Advanced Packaging for Flash Memory
Steve Liang
CTO, Jiangsu Changjiang Electronics Technology Co., Ltd

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Critical challenges and solutions in 3D NAND volume manufacturing
Rich Wise
Technical Managing Director, Global Product Group, Lam Research Corporation
Memory Packaging Challenges for the New Era
E. Jan Vardaman
President of TechSearch International, Inc.

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