Heterogeneous Integration International Conference(HIIC)


Date: Tuesday, March 19, 2024
Time: 09:30-17:30
Venue: Pudong Ballroom 5, Kerry Hotel Pudong, Shanghai
Chinese and English Simultaneous Interpretation will be provided

Attendee Registration   Previous Review

Artificial Intelligence (AI) is at the forefront of the fourth industrial revolution and rapidly penetrating into everyone’s daily life such as smart Cars, IoT and ChatGPT. This creates ever-increasing demands on high transmission speed, memory capacity, and low power consumption for chips to handle massive date.

As the transistor geometry scaling is approaching physical limits and no longer economic effective, advanced system integration technology, especially heterogeneous Integration(HI), will be the way to meet requirements of digital transformation, continue to unleash semiconductor technology innovation in coming decades.

Heterogeneous Integration technology integrate Chiplet in 2D, 2.5D, 3DIC process, and co-integrate electrical compute system with optical I/O and networking to create SiP (System in Package), integrated modules/subsystems or complete functional systems, provide fuel for AI revolution.

This year's HIIC conference invites global leaders and experts from advance packaging and related ecosystem industries to share the latest HIR, technological advancements, emerging trends, and their insights and visions. Audience would benefit from this forum the opportunity and challenges of Heterogeneous Integration and advanced system packaging.

Organizer:
 

SPONSORS
 
         
         
     
         

KEY TOPICS:
♦ Heterogeneous Integration Roadmap (HIR) 2023 Edition
♦ Hybrid bonding, SiP, Chiplet for AI/HPC
♦ Advanced packaging materials and equipment
♦ Technology and market trends
♦ System testing solution


Agenda / 议程
   
09:00-09:30 Registration 来宾登记
   
09:30-09:40
Moderator
Feng Ling, CEO, Xpeedic
凌峰,芯和半导体科技(上海)股份有限公司CEO
   
09:40-10:00
Welcome speech 欢迎致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙,SEMI全球副总裁,中国区总裁
   
  Heterogeneous integration enabling AI/5G
异构集成赋能AI/5G浪潮
   
10:00-10:30
Heterogeneous Integration in Motion
Ingu Yin Chang, Senior Vice President, Sales & Marketing, ASE
Ingu  Yin Chang,日月光高级副总裁
   
10:30-11:00
Chiplet Packaging Technology: Current Status and Future Development
Chiplet 封装技术的现状和发展趋势

Dr. Yifan Guo, EVP, Yibu Semiconductor
郭一凡,易卜半导体,执行副总裁
   
11:00-11:30
Semiconductors for Sensors – A holistic perspective
半导体传感器 – 一个全面的视角

Leopold Beer, GM of Sensing Division, Renesas Electronics Corporation
Leopold Beer,瑞萨电子传感器事业部负责人
   
11:30-12:00
Fostering an Open and Inter-operable Chiplet Ecosystem
共建开放互通的芯粒生态

JianChen, Chief Architect, Aliyun, board member of CXL and UCle
陈建,阿里云智能首席云服务器架构师,CXL和UCle董事会成员
   
12:00-13:30 Lunch break
   
13:30-13:40
Moderator
Dr. Huili Fu, VP of T-Head, Alibaba
符会利,阿里巴巴,平头哥副总裁
   
  Advanced packaging technologies and key processes
先进封装技术与关键工艺
   
13:40-14:00
Dr. Daquan Yu, CEO of Xiamen Sky Semiconductor Co., Ltd.
于大全,厦门云天半导体科技有限公司,董事长
   
14:00-14:20
Odd Hung, SVP, ICLEAGUE TECHNOLOGY CO.,LTD.
洪齐元,芯盟科技有限公司,资深副总裁
   
14:20-14:40
Chiplets and Advanced Heterogeneous Integration
小芯片及先进异构集成

Terry Wu, Director, Samsung Electronics
吴政达,三星电子,总监
   
14:40-15:00
Test Challenges in the AI Era
AI 时代下的测试“芯”挑战

Dr. Jeorge S. Hurtarte, Sr. Director, SOC Product Strategy, Teradyne Inc.
Dr. Jeorge S. Hurtarte, 泰瑞达SOC产品战略高级总监和首席营销策略师
   
15:00-15:20
Innovations in Equipment Drive Rapid Growth of the Advanced Packaging Industry in the Computing Era
以装备创新助推算力时代先进封装产业腾飞

Wang Na, VP, Beijing NAURA Microelectronics Equipment Co., Ltd.
王娜,北京北方华创微电子装备有限公司,副总裁
   
15:20-15:40
AI CHIP & JSSI Advanced PKG Total Solution
人工智能芯片以及芯德科技全方位先进封装解决方案

Zhang Zhong, JSSI, Vice General Manager
张中, 江苏芯德半导体科技有限公司, 副总经理
   
  Design, inspection and ecosystem
设计、检测与生态系统
   
15:40-16:00
Application and Development of Heterogeneous Integration Technology in Unisoc
紫光展锐异质集成技术的应用与发展

Si Chen, Director of Packaging System Engineering, Unisoc
陈思,紫光展锐封装系统架构部负责人
   
16:00-16:20
Innovations in AI Chip Packaging: Advanced Processes & Equipment Technologies
AI 芯片封装的创新: 先进工艺和设备技术

Lee Chee Ping, Senior Director, Advanced Packaging Customer Operations, Lam Research Corporation
Lee Chee Ping, 泛林集团,先进封装客户运营资深总监
   
16:20-16:40
Future trends in advanced wafer-level packaging and the impact of miniaturization on defect inspection
晶圆级先进封装的未来趋势以及微小化对于缺陷检测的影响

Richard Yeoh, Senior Product Marketing Manager, KLA Corporation
Richard Yeoh, KLA 产品线资深市场经理
   
16:40-17:00
Heterogeneous Integration Fuels the Automotive Future
异构集成助推未来汽车

Shaun Bowers, Senior Analyst, TechSearch International, Inc.
Shaun Bowers, TechSearch International, Inc.高级分析师
   
17:00-17:10
Closing remark 闭幕致辞
Dr. Huili Fu, VP of T-Head, Alibaba
符会利,阿里巴巴,平头哥副总裁
   
* 议程以最终版为准
* Please refer to the final version of Agenda.
   

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Hannah zhao
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