Heterogeneous Integration (Advanced Packaging) International Conference (HIIC)
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Date:
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Tuesday, March 19, 2024
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Time:
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09:30-17:30
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Venue:
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Pudong Ballroom 5, Kerry Hotel Pudong, Shanghai
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Chinese and English Simultaneous Interpretation will be provided
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Attendee Registration Previous Review
Artificial Intelligence (AI) is at the forefront of the fourth industrial revolution and rapidly penetrating into everyone’s daily life such as smart Cars, IoT and ChatGPT. This creates ever-increasing demands on high transmission speed, memory capacity, and low power consumption for chips to handle massive date.
As the transistor geometry scaling is approaching physical limits and no longer economic effective, advanced system integration technology, especially heterogeneous Integration(HI), will be the way to meet requirements of digital transformation, continue to unleash semiconductor technology innovation in coming decades.
Heterogeneous Integration technology integrate Chiplet in 2D, 2.5D, 3DIC process, and co-integrate electrical compute system with optical I/O and networking to create SiP (System in Package), integrated modules/subsystems or complete functional systems, provide fuel for AI revolution.
This year's HIIC conference invites global leaders and experts from advance packaging and related ecosystem industries to share the latest HIR, technological advancements, emerging trends, and their insights and visions. Audience would benefit from this forum the opportunity and challenges of Heterogeneous Integration and advanced system packaging.
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Organizer:
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SPONSORS
KEY TOPICS:
♦ Heterogeneous Integration Roadmap (HIR) 2023 Edition
♦ Hybrid bonding, SiP, Chiplet for AI/HPC
♦ Advanced packaging materials and equipment
♦ Technology and market trends
♦ System testing solution
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Agenda / 议程
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09:00-09:30
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Registration 来宾登记
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09:30-09:40
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Moderator
Feng Ling, Founder and CEO, Xpeedic Co. Ltd
凌峰，芯和半导体科技（上海）股份有限公司，创始人及CEO
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09:40-10:00
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Welcome speech 欢迎致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁，中国区总裁
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Session 1: Heterogeneous integration enabling AI/5G
异构集成赋能AI/5G浪潮
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10:00-10:30
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Accelerating the AI economy through Heterogeneous Integration
异构集成加速人工智能经济发展
Ingu Yin Chang, Senior Vice President, Sales & Marketing, ASE
Ingu Yin Chang，日月光高级副总裁
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10:30-11:00
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Chiplet Packaging Technology: Current Status and Future Development
Chiplet 封装技术的现状和发展趋势
Dr. Yifan Guo, EVP, Yibu Semiconductor
郭一凡，易卜半导体，执行副总裁
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11:00-11:30
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Semiconductors for Sensors – A holistic perspective
半导体传感器 – 一个全面的视角
Leopold Beer, GM of Sensing Division, Renesas Electronics Corporation
Leopold Beer，瑞萨电子传感器事业部负责人
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11:30-12:00
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Fostering an Open and Inter-operable Chiplet Ecosystem
共建开放互通的芯粒生态
JianChen, Chief Architect, Aliyun, board member of CXL and UCle
陈健，阿里云智能首席云服务器架构师，CXL和UCle董事会成员
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12:00-13:30
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Lunch break
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13:30-13:40
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Moderator
Dr. Huili Fu, Senior VP of T-Head, Alibaba
符会利，阿里巴巴，平头哥高级副总裁
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Session 2: Advanced packaging technologies and key processes
先进封装技术与关键工艺
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13:40-14:00
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Wafer-level Heterogeneous Integration based on Through Glass Via Technology
基于圆片级玻璃通孔的异构集成技术
Dr. Daquan Yu, CEO of Xiamen Sky Semiconductor Co., Ltd.
于大全，厦门云天半导体科技有限公司，董事长
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14:00-14:20
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SOHTM reshapes the semiconductor ecosystem
专注异构集成，重塑半导体生态
Odd Hung, Co-CEO, ICLEAGUE TECHNOLOGY CO.,LTD.
洪齐元，芯盟科技有限公司，联席总裁
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14:20-14:40
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Chiplets and Advanced Heterogeneous Integration
小芯片及先进异构集成
Terry Wu, Director, Samsung Electronics
吴政达，三星电子，总监
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14:40-15:00
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Test Challenges in the AI Era
AI 时代下的测试“芯”挑战
Dr. Jeorge S. Hurtarte, Sr. Director, SOC Product Strategy, Teradyne Inc.
Dr. Jeorge S. Hurtarte, 泰瑞达SOC产品战略高级总监和首席营销策略师
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15:00-15:20
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Innovations in Equipment Drive Rapid Growth of the Advanced Packaging Industry in the Computing Era
以装备创新助推算力时代先进封装产业腾飞
Wang Na, VP, Beijing NAURA Microelectronics Equipment Co., Ltd.
王娜，北京北方华创微电子装备有限公司，副总裁
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15:20-15:40
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AI CHIP & JSSI Advanced PKG Total Solution
人工智能芯片以及芯德科技全方位先进封装解决方案
Zhang Zhong, JSSI, Vice General Manager
张中, 江苏芯德半导体科技有限公司, 副总经理
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Session 3: Design, inspection and ecosystem
设计、检测与生态系统
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15:40-16:00
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Development and Challenge of Heterogeneous Integration Technology
异质集成技术的发展与挑战
Si Chen, Director of Packaging System Engineering, Unisoc
陈思，紫光展锐封装系统架构部负责人
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16:00-16:20
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Heterogeneous integration technology and its prospects for Silicon photonics
硅光异质异构集成技术和展望
Weining Li, R&D Pilot Line Leader, SVP, SITRI
李卫宁，上海微技术工业研究院，研发中试线负责人，资深副总经理
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16:20-16:40
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Innovations in AI Chip Packaging: Advanced Processes & Equipment Technologies
AI 芯片封装的创新： 先进工艺和设备技术
Lee Chee Ping, Senior Director, Advanced Packaging Customer Operations, Lam Research Corporation
Lee Chee Ping, 泛林集团，先进封装客户运营资深总监
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16:40-17:00
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Future trends in advanced wafer-level packaging and the impact of miniaturization on defect inspection
晶圆级先进封装的未来趋势以及微小化对于缺陷检测的影响
Richard Yeoh, Senior Product Marketing Manager, KLA Corporation
Richard Yeoh, KLA 产品线资深市场经理
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17:00-17:20
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Heterogeneous Integration Fuels the Automotive Future
异构集成助推未来汽车
Shaun Bowers, Senior Analyst, TechSearch International, Inc.
Shaun Bowers, TechSearch International, Inc.高级分析师
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17:20-17:30
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Closing remark 闭幕致辞
Dr. Huili Fu, Senior VP of T-Head, Alibaba
符会利，阿里巴巴，平头哥高级副总裁
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* 议程以最终版为准
* Please refer to the final version of Agenda.
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CONTACT US:
Hannah zhao
021-60278571
[email protected]
