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Lee Chee Ping Senior Director, Advanced Packaging Customer Operations, Lam Research Corporation 泛林集团，先进封装客户运营资深总监 |
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讲师简介 / Speaker Bio Lee Chee Ping is a Senior Director at Lam Research, with over 19 years of expertise in the semiconductor industry, specifically focusing on advanced packaging and heterogeneous integration. He has led global field packaging process teams, collaborating extensively with clients on the development and qualification of 2D, 2.5D, and 3D technologies. Lee Chee Ping actively engages with the microelectronics supply chain, fostering meaningful exchanges with fabless entities, IDMs, OSATs, and equipment/material suppliers globally. His profound knowledge of the industry positions him to oversee comprehensive market analysis and technology trend mapping for advanced packaging in Lam Research, as part of efforts to develop next generation innovations. Additionally, he spearheads the technical marketing efforts for Lam's wafer and panel-level equipment solutions. Lee Chee Ping's insights have been shared at various prestigious advanced semiconductor packaging conferences. Lee Chee Ping received his M.Eng in Technology Management from the University of South Australia, as well as both M.Sc in Financial Engineering and B.Eng in Chemical Engineering from National University of Singapore. |
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